G02B 6/4236
Fixing or mounting methods of the aligned elements
Official title: {Fixing or mounting methods of the aligned elements}
G02B6/4236 (Fixing or mounting methods of the aligned elements) appears on 2,584 US grants and 2,640 published applications in this corpus.
Search patents in G02B- Granted patents
- 2,584
- Published applications
- 2,640
- Assignees
- 856
- Inventors
- 5,209
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 7 | 0 |
| 1985 | 6 | 0 |
| 1986 | 6 | 0 |
| 1987 | 19 | 0 |
| 1988 | 26 | 0 |
| 1989 | 27 | 0 |
| 1990 | 13 | 0 |
| 1991 | 24 | 0 |
| 1992 | 18 | 0 |
| 1993 | 23 | 0 |
| 1994 | 31 | 0 |
| 1995 | 21 | 0 |
| 1996 | 23 | 0 |
| 1997 | 42 | 0 |
| 1998 | 53 | 0 |
| 1999 | 57 | 0 |
| 2000 | 57 | 0 |
| 2001 | 80 | 42 |
| 2002 | 95 | 176 |
| 2003 | 130 | 163 |
| 2004 | 125 | 125 |
| 2005 | 104 | 92 |
| 2006 | 91 | 47 |
| 2007 | 60 | 48 |
| 2008 | 44 | 24 |
| 2009 | 29 | 34 |
| 2010 | 28 | 30 |
| 2011 | 26 | 62 |
| 2012 | 22 | 43 |
| 2013 | 32 | 68 |
| 2014 | 50 | 79 |
| 2015 | 71 | 75 |
| 2016 | 102 | 111 |
| 2017 | 134 | 142 |
| 2018 | 118 | 121 |
| 2019 | 125 | 114 |
| 2020 | 104 | 106 |
| 2021 | 79 | 131 |
| 2022 | 103 | 138 |
| 2023 | 92 | 144 |
| 2024 | 79 | 159 |
| 2025 | 114 | 209 |
| 2026 | 76 | 157 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
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- Transistor-outline package and preparation method thereof, optical sub-assembly, optical module, and optical network system6 Oct 2026US 12,754,382 B2Huawei Technologies Co., Ltd.
- Optical fiber array with optical passthrough6 Oct 2026US 12,754,384 B2Lightmatter, Inc.
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- 400G silicon photonic integrated optical module with photoelectric integrated substrate29 Sep 2026US 12,748,268 B2SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- Method of forming fiber array unit structure8 Oct 2026US 2026/0309938 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Glass waveguides with barrier layer8 Oct 2026US 2026/0309940 A1Corning Incorporated
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
- Optoelectronic module1 Oct 2026US 2026/0299221 A1ams-OSRAM International GmbH
- Optical element assembly, method for manufacturing optical element assembly, optical module, optical engine, and xr glasses1 Oct 2026US 2026/0299224 A1TDK Corporation
Most cited
By later US patents
- Optical ready substrates300US 7,110,629 B2APPLIED Materials.Inc. · 2006
- Optical ready wafers279US 7,043,106 B2APPLIED Materials.Inc. · 2006
- Removable transceiver module and receptacle254US 5,879,173 AMethode Electronics, Inc. · 1999
- Fiber-optic modules with housing/shielding247US 6,659,655 B2E20 Communications, Inc. · 2003
- Patch cord221US 5,305,405 AADC Telecommunications, Inc. · 1994