G02B 6/4239
Adhesive bonding
Official title: {Adhesive bonding; Encapsulation with polymer material}
G02B6/4239 (Adhesive bonding) appears on 764 US grants and 896 published applications in this corpus.
Search patents in G02B- Granted patents
- 764
- Published applications
- 896
- Assignees
- 384
- Inventors
- 1,932
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 7 | 0 |
| 1998 | 7 | 0 |
| 1999 | 16 | 0 |
| 2000 | 11 | 0 |
| 2001 | 24 | 17 |
| 2002 | 36 | 56 |
| 2003 | 43 | 47 |
| 2004 | 36 | 29 |
| 2005 | 27 | 26 |
| 2006 | 23 | 13 |
| 2007 | 16 | 15 |
| 2008 | 14 | 10 |
| 2009 | 11 | 10 |
| 2010 | 12 | 12 |
| 2011 | 5 | 16 |
| 2012 | 4 | 5 |
| 2013 | 7 | 24 |
| 2014 | 12 | 30 |
| 2015 | 22 | 25 |
| 2016 | 36 | 37 |
| 2017 | 50 | 49 |
| 2018 | 41 | 45 |
| 2019 | 50 | 51 |
| 2020 | 43 | 37 |
| 2021 | 21 | 39 |
| 2022 | 33 | 47 |
| 2023 | 26 | 43 |
| 2024 | 22 | 58 |
| 2025 | 34 | 97 |
| 2026 | 28 | 58 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transistor-outline package and preparation method thereof, optical sub-assembly, optical module, and optical network system6 Oct 2026US 12,754,382 B2Huawei Technologies Co., Ltd.
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Optical module, optical connector cable, and method for producing optical module25 Aug 2026US 12,717,095 B2Sumitomo Electric Industries, Ltd.
- Integrated fiber array unit structure including embedded passive optical components and method for forming the same25 Aug 2026US 12,717,096 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Direct silicon-to-silicon bonding for fiber-first packaging process14 Jul 2026US 12,681,245 B2Ayar Labs, Inc.
- Method of forming fiber array unit structure8 Oct 2026US 2026/0309938 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Glass waveguides with barrier layer8 Oct 2026US 2026/0309940 A1Corning Incorporated
- Fiber optic cable structure including foldable fiber optic cable with coupler therefor and related method1 Oct 2026US 2026/0299226 A1GLOBALFOUNDRIES U. S. Inc.
- Optical package structure and manufacturing method thereof24 Sep 2026US 2026/0287840 A1Siliconware Precision Industries Co., Ltd.
- Optoelectronic module24 Sep 2026US 2026/0287841 A1Panelsemi Corporation
Most cited
By later US patents
- Optical transmission terminal device160US 5,960,141 AFujitsu Limited · 1999
- Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector120US 4,130,343 ABell Telephone Laboratories, Incorporated · 1978
- Laser diode module with integral cooling107US 6,072,814 AVideojet Systems International, Inc. · 2000
- Optoelectronic packaging106US 6,456,766 B1Cornell Research Foundation, Inc. · 2002
- Connecting and aligning optical fibres and waveguides91US 4,744,619 ABritish Telecommunications Public Ltd.Co. · 1988