Integrated fiber array unit structure including embedded passive optical components and method for forming the same

A method of forming a fiber array unit (FAU) structure, comprising:

• forming a reflective layer over a silicon substrate, wherein the reflective layer comprises a plurality of reflectors embedded within a dielectric layer;
• bonding a glass cover to a side of the reflective layer opposite the silicon substrate;
• thinning the silicon substrate to form a thinned silicon substrate;
• etching the thinned silicon substrate to form a silicon lens layer comprising a plurality of silicon lenses;
• performing a singulation process to cut through the glass cover, the reflective layer, and the silicon lens layer to separate a plurality of passive optical component structures;
• providing a fiber array unit (FAU);
• and
• attaching the FAU and the passive optical component structure to a carrier board, wherein the FAU and the passive optical component structure are adjacent to each other.

A method of forming a fiber array unit (FAU) structure, comprising:

• forming a reflective layer over a silicon substrate, wherein the reflective layer comprises a plurality of reflectors embedded within a dielectric layer;
• forming a protection layer on a side of the reflective layer opposite the silicon substrate;
• bonding a glass cover to the protection layer;
• thinning the silicon substrate to form a thinned silicon substrate;
• etching the thinned silicon substrate to form a silicon lens layer comprising a plurality of silicon lenses;
• bonding a carrier board to a side of the silicon lens layer opposite the reflective layer;
• removing the glass cover;
• removing the protection layer, the reflective layer, and the silicon lens layer over the carrier board in a fiber placement area of the carrier board;
• cutting through the protection layer, the reflective layer, the silicon lens layer, and the carrier board to separate a plurality of passive optical component structures, wherein each of the plurality of passive optical component structures is bonded to the carrier board after performing the cutting;
• providing a fiber array unit (FAU);
• and
• attaching the FAU to the fiber placement area of the carrier board.