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US 2026/0287840 A1Published application
Optical package structure and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsShuai-Lin LIU, Hung-Kun CHEN
Life of this patent
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Abstract
An optical package structure is provided and includes a first optical package unit and a second optical package unit. The first optical package unit and the second optical package unit are communicatively connected to each other via an optical transmission element. This arrangement improves signal communication performance. A method of manufacturing the optical package structure is further provided.
Claims28
An optical package structure, comprising:
- a first optical package unit including a first electronic element and a first optical engine;
- a second optical package unit including a second electronic element and a second optical engine;
- and
- an optical transmission element having one end connected to the first optical engine of the first optical package unit and the other end connected to the second optical engine of the second optical package unit.
1 more element
A method of manufacturing an optical package structure, comprising:
- providing a first optical package unit including a first electronic element and a first optical engine;
- providing a second optical package unit including a second electronic element and a second optical engine;
- and
- connecting the first optical package unit and the second optical package unit with an optical transmission element, wherein one end of the optical transmission element is connected to the first optical engine of the first optical package unit, and the other end of the optical transmission element is connected to the second optical engine of the second optical package unit.
1 more element
Dependencies are inferred from the claim text.