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US 12,681,245 B2Granted
Direct silicon-to-silicon bonding for fiber-first packaging process
AssigneeAyar Labs, Inc.
InventorsChong Zhang, Haiwei Lu, Steve Groothuis
Life of this patent
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Abstract
An electro-optical chip assembly includes a silicon baseplate and an electro-optical chip. The electro-optical chip has a silicon substrate that is fusion bonded to the silicon baseplate. The electro-optical chip is manufactured separate from the silicon baseplate before fusion bonding of the silicon substrate of the electro-optical chip to the silicon baseplate.
Claims22
An electro-optical chip assembly, comprising:
- a silicon baseplate;
- an electro-optical chip having a silicon substrate, the silicon substrate of the electro-optical chip fusion bonded to the silicon baseplate, wherein the electro-optical chip is manufactured separate from the silicon baseplate before fusion bonding of the silicon substrate of the electro-optical chip to the silicon baseplate, wherein a ball grid array is disposed on a surface of the electro-optical chip that faces away from the silicon baseplate, wherein the electro-optical chip is in a pre-solder-reflow state such that solder balls of the ball grid array have not yet been reflowed;
- and
- a plurality of optical fibers attached to the electro-optical chip.
1 more element
An electro-optical chip wafer assembly, comprising:
- a silicon base wafer;
- and
- a plurality of electro-optical chips distributed across the silicon base wafer, each of the plurality of electro-optical chips having a silicon substrate fusion bonded to the silicon base wafer, wherein each of the plurality of electro-optical chips is manufactured on a semiconductor wafer that is separate from the silicon base wafer.
A method for manufacturing an electro-optical chip assembly, comprising:
- attaching an electro-optical chip to a carrier wafer such that a silicon substrate of the electro-optical chip faces away from the carrier wafer;
- positioning the carrier wafer over a silicon base wafer such that the silicon substrate of the electro-optical chip faces toward the silicon base wafer;
- applying a force to the carrier wafer to press the silicon substrate of the electro-optical chip against the silicon base wafer;
- fusion bonding the silicon substrate of the electro-optical chip with the silicon base wafer;
- and
- releasing the carrier wafer from the electro-optical chip.
3 more elements
Dependencies are inferred from the claim text.