Loading patent…
OwnerJae-Wung LEE, Mikko HARJANNE +3inventors
InventorsJae-Wung LEE, Mikko HARJANNE, Tomi HASSINEN, Timo AALTO, Giovanni DELROSSO
Estimating the term…
A bonding structure (100) and a method for active alignment of an optical axis (OAX1) of a semiconductor optical device (20) with an optical axis (OAX2) of an optical circuit (30) on a substrate (10), and a photonic integrated circuit (110). The bonding structure (100) comprises at least one first bonding member (11) on the substrate (10) for first bonding the semiconductor optical device (20) to the substrate (10), wherein the first bonding member (11) is made of material, such as porous metal, exhibiting plastic deformation to allow deforming of the at least one first bonding member (11) during the active alignment. Furthermore, the bonding structure (100) comprises at least one second bonding member (12) on the substrate (10) for second bonding the semiconductor optical device (20) to the substrate (10) upon completion or after the active alignment.
A bonding structure (100) on a substrate (10) for active alignment of an optical axis (OAX1) of a semiconductor optical device (20) with an optical axis (OAX2) of an optical circuit (30) on the substrate (10), wherein the bonding structure (100) comprises:
A method for active alignment of an optical axis (OAX1) of a semiconductor optical device (20) with an optical axis (OAX2) of an optical circuit (30) on a substrate (10), the method comprising:
Dependencies are inferred from the claim text.