Integrated microelectromechanical alignment and locking apparatus and method for fiber optic module manufacturing
AssigneeMcDonnell Douglas Corporation
InventorsJohn M. Haake, Mark W. Beranek
Life of this patent
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Abstract
An apparatus and a method for aligning an optical fiber with an optoelectronic device inside an optoelectronic package using an internal automated micro-aligner and internal solder heater means for locking the optical fiber in a precisely aligned position with the optoelectronic device.
Claims15
An alignment and locking system for aligning an optical fiber with an optoelectronic device housed inside an optoelectronic package and locking the optical fiber in place, said system comprising:
- an optoelectronic package including:
- sidewalls and a device floor defining an enclosure,
- an optoelectronic device housed inside the enclosure,
- a micro-aligner positioned inside the enclosure and overlying the device floor,
- a heater overlying the device floor;
- and
- a solder preform overlying said heater and positioned between the optoelectronic device and the micro-aligner, and the optical fiber being secured upon the micro-aligner and positioned adjacent said solder preform, said solder preform having a known melting temperature and being attached to said heater;
- a microprocessor;
- a power source for supplying electrical power to said heater suitable for causing said solder preform to melt based on power control signals received by said power source from said microprocessor;
- an instrument for determining the amount of light passing between said optical fiber and said optoelectronic device and supplying related received power signals to said microprocessor;
- and
- wherein the micro-aligner moves the optical fiber into optical alignment with the optoelectronic device based on alignment control signals received from said microprocessor, said alignment control signals being based on said received power control signals, and said micro-aligner aligning said optical fiber while said solder preform is in a molten state.
A method of aligning an optical fiber with an optoelectronic device housed inside an optoelectronic package and locking the optical fiber in place, said method comprising the steps of:
- providing an optoelectronic package including:
- sidewalls and a device floor defining an enclosure,
- an optoelectronic device housed inside the enclosure,
- a micro-aligner positioned inside the enclosure and overlying the device floor,
- a heater overlying the device floor;
- a solder preform overlying said heater and positioned between the optoelectronic device and the micro-aligner, said solder preform having a known melting temperature and being attached to said heater;
- securing an optical fiber upon the micro-aligner;
- positioning the optical fiber adjacent said solder preform located atop said heater positioned overlying the device floor;
- supplying electrical power to said heater for a predetermined time period sufficient for the heater to heat the solder preform to the melting point of the solder to render the solder preform molten;
- passing light between said optical fiber and said optoelectronic device while said solder preform is in the molten state;
- detecting the amount of light passing between said optical fiber and said optoelectronic device while said solder preform is in the molten state;
- automatically manipulating the position of said optical fiber relative to said optoelectronic device using said micro-aligner so as to increase the amount of light passing between said optical fiber and said optoelectronic device while said solder preform is in the molten state;
- and
- solidifying said solder preform.
Dependencies are inferred from the claim text.