Optoelectronics package for a semiconductor laser

An optoelectronics package comprising,

• a sealed enclosure, said sealed enclosure containing an optical bench along which is defined an optical axis,
• a semiconductor laser mounted on the optical bench, said semiconductor laser having front and rear facets of optical emission along the optical axis,
• a monitor of optical emission mounted on the optical bench for receiving optical emission from the rear facet of emission,
• a lens focused on the front facet for transmitting optical emission from the front facet along the optical axis,
• first positioning means for securing the lens to the optical bench with the lens focused on the front facet,
• an optical fiber extending from the interior of the enclosure to an exterior of the enclosure, said optical fiber having first and second optical faces, said optical fiber receiving on said first optical face optical emission transmitted through said lens from the front facet of said laser, and
• second positioning means for securing the optical fiber to said optical bench with the first optical face aligned with the optical axis and the second optical face projecting to an exterior of the enclosure,
• electrical contact terminals extending from the interior of the enclosure to the exterior of the enclosure, said electrical contact terminals electrically connecting the laser and the monitor, and
• cooling means disposed within said enclosure for cooling said laser.