G01R 31/71
Testing of solder joints
G01R31/71 (Testing of solder joints) appears on 127 US grants and 116 published applications in this corpus.
Search patents in G01R- Granted patents
- 127
- Published applications
- 116
- Assignees
- 97
- Inventors
- 310
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 5 | 2 |
| 2002 | 3 | 4 |
| 2003 | 3 | 4 |
| 2004 | 6 | 2 |
| 2005 | 5 | 3 |
| 2006 | 1 | 5 |
| 2007 | 5 | 5 |
| 2008 | 1 | 3 |
| 2009 | 4 | 5 |
| 2010 | 5 | 0 |
| 2011 | 3 | 5 |
| 2012 | 0 | 11 |
| 2013 | 8 | 6 |
| 2014 | 7 | 9 |
| 2015 | 4 | 6 |
| 2016 | 6 | 2 |
| 2017 | 5 | 3 |
| 2018 | 3 | 6 |
| 2019 | 3 | 5 |
| 2020 | 4 | 5 |
| 2021 | 8 | 6 |
| 2022 | 6 | 5 |
| 2023 | 3 | 4 |
| 2024 | 4 | 4 |
| 2025 | 5 | 4 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device for detecting bonding defects9 Jun 2026US 12,650,710 B2LG Display Co., Ltd.
- Substrate and semiconductor package16 Dec 2025US 12,500,182 B2Sony Group Corporation
- Systems and methods for testing electrical connections between a chip and external circuitry25 Nov 2025US 12,481,007 B2NXP B. V.
- Semiconductor device and method for determining deterioration of semiconductor device7 Oct 2025US 12,438,056 B2Fuji Electric Co., Ltd.
- Method and apparatus for measuring electromigration of solder joint12 Aug 2025US 12,385,986 B2Sanechips Technology Co., Ltd.
- Failure detection system and method21 May 2026US 2026/0140227 A1NXP B. V.
- Solder contact resistance/resistivity testing structure26 Feb 2026US 2026/0060042 A1International Business Machines Corporation
- Systems and methods for testing electrical connections between a chip and external circuitry1 May 2025US 2025/0138110 A1NXP B. V.
- Solder ball detecting device, printed circuit board, radar chip and electronic equipment24 Apr 2025US 2025/0130293 A1Calterah Semiconductor Technology (Shanghai) Co., Ltd.
- Method and device for inspecting junction portion of power module10 Apr 2025US 2025/0116695 A1Hyundai Motor Company
Most cited
By later US patents
- Identification of pin-open faults by capacitive coupling through the integrated circuit package67US 5,254,953 AHewlett-Packard Company · 1993
- Semiconductor device and soldering portion inspecting method therefor52US 5,914,536 AKabushiki Kaisha Toshiba · 1999
- Identification of pin-open faults by capacitive coupling through the integrated circuit package47US 5,557,209 AHewlett-Packard Company · 1996
- Method and apparatus for inspecting solder portions47US 5,598,345 AMatsushita Electric Industrial Co., Ltd. · 1997
- Apparatus and method for testing the connections between an integrated circuit and a printed circuit board46US 5,818,251 ANational Semiconductor Corporation · 1998