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AssigneeKabushiki Kaisha Toshiba
InventorsYasushi Shizuki, Yuji Iseki, Naoko Ono, Kunio Yoshihara, Masayuki Saito, Hiroshi Yamada, Kazuki Tateyama
Estimating the term…
A semiconductor device includes a wiring board having a main surface and a plurality of pad electrodes formed on the main surface, a rectangular semiconductor element having a main surface facing the main surface of the wiring board and mounted on the main surface of the wiring board, a solder resist formed to surround the semiconductor element with a preset distance therefrom on the main surface of the wiring board, a plurality of terminal electrodes formed on the end portion of the main surface of the semiconductor element, and a plurality of solder bumps for electrically connecting the plurality of pad electrodes to the plurality of terminal electrodes with a gap provided between the main surface of the wiring board and the main surface of the semiconductor element, wherein each of the plurality of pad electrodes includes at least a portion which extends from substantially under a corresponding one of the plurality of terminal electrodes of the semiconductor element to the solder resist lying outside the semiconductor element and each of the plurality of solder bumps includes a portion extending over part of a corresponding one of the plurality of pads which lies outside the semiconductor element.
A semiconductor element for a semiconductor device comprising:
A semiconductor element for a semiconductor device comprising:
Dependencies are inferred from the claim text.