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US 12,385,986 B2Granted
Method and apparatus for measuring electromigration of solder joint
AssigneeSanechips Technology Co., Ltd.
InventorsNiuyi Sun, Dan Yang, Na Mei, Tuobei Sun
Life of this patent
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Abstract
Disclosed are a method and an apparatus for measuring electromigration of solder joints. The method includes: determining, according to voltage test pads led out from both ends of one or more solder joints, a voltage of a daisy subchain between the one or more solder joints (S502); and determining, according to the voltage, a resistance of the one or more solder joints (S504).
Claims15
An apparatus for measuring electromigration of solder joints, comprising:
- a power source, a controller, and a voltage measurement structure, wherein the power source is respectively connected to the controller and the voltage measurement structure in parallel, the voltage measurement structure comprises an upper substrate and a lower substrate, metal connecting wires on the upper substrate and the lower substrate are connected in series through a plurality of solder joints to form a daisy chain, and voltage test pads are led out from both ends of each of the plurality of solder joints and arranged outside the upper substrate and the lower substrate, respectively,
- the voltage measurement structure is configured to measure a voltage of a daisy subchain between one or more solder joints through the voltage test pads under control of the controller;
- and
- the controller is configured to determine, according to the voltage, a resistance of the one or more solder joints,
- wherein the controller is further configured to:
- select a first daisy subchain and a second daisy subchain which meet a minimum test precision, wherein solder joints at two ends of each of the first daisy subchain and the second daisy subchain are a first solder joint and a second solder joint, the first daisy subchain is provided with one more target solder joint than the second daisy subchain, the target solder joint is the first solder joint, and a number of solder joints comprised in the first daisy subchain is greater than or equal to a number of solder joints on a predetermined shortest daisy subchain;
- measure, according to voltage test pads corresponding to the first solder joint, a first voltage and a second voltage of the first solder joint, and measure, according to voltage test pads corresponding to the second solder joint, a first voltage and a second voltage of the second solder joint;
- and
- determine, according to the first voltage and the second voltage of the first solder joint and the first voltage and the second voltage of the second solder joint, a resistance of the target solder joint.
6 more elements
A method for measuring electromigration of solder joints, comprising:
- determining, according to voltage test pads led out from both ends of one or more solder joints, a voltage of a daisy subchain between the one or more solder joints;
- and
- determining, according to the voltage, a resistance of the one or more solder joints,
- wherein determining, according to voltage test pads led out from both ends of one or more solder joints, the voltage of the daisy subchain between the one or more solder joints comprises:
- selecting a first daisy subchain and a second daisy subchain which meet a minimum test precision, wherein solder joints at two ends of each of the first daisy subchain and the second daisy subchain are a first solder joint and a second solder joint, the first daisy subchain is provided with one more target solder joint than the second daisy subchain, the target solder joint is the first solder joint, and a number of solder joints comprised in the first daisy subchain is greater than or equal to a number of solder joints on a predetermined shortest daisy subchain;
- measuring, according to voltage test pads corresponding to the first solder joint, a first voltage and a second voltage of the first solder joint, and measuring, according to voltage test pads corresponding to the second solder joint, a first voltage and a second voltage of the second solder joint;
- and
- determining, according to the first voltage and the second voltage of the first solder joint and the first voltage and the second voltage of the second solder joint, a resistance of the target solder joint.
5 more elements
An apparatus for measuring electromigration of solder joints, comprising:
- a first determination module configured to determine, according to voltage test pads led out from both ends of one or more solder joints, a voltage of a daisy subchain between the one or more solder joints;
- and
- a second determination module configured to determine, according to the voltage, a resistance of the one or more solder joints,
- wherein the first determination module is further configured to:
- select a first daisy subchain and a second daisy subchain which meet a minimum test precision, wherein solder joints at two ends of each of the first daisy subchain and the second daisy subchain are a first solder joint and a second solder joint, the first daisy subchain is provided with one more target solder joint than the second daisy subchain, the target solder joint is the first solder joint, and a number of solder joints comprised in the first daisy subchain is greater than or equal to a number of solder joints on a predetermined shortest daisy subchain;
- measure, according to voltage test pads corresponding to the first solder joint, a first voltage and a second voltage of the first solder joint, and measure, according to voltage test pads corresponding to the second solder joint, a first voltage and a second voltage of the second solder joint;
- and
- determine, according to the first voltage and the second voltage of the first solder joint and the first voltage and the second voltage of the second solder joint, a resistance of the target solder joint.
5 more elements
Dependencies are inferred from the claim text.