G01R 31/70
Testing of connections between components and printed circuit boards
Official title: Testing of connections between components and printed circuit boards (G01R31/68 takes precedence)
G01R31/70 (Testing of connections between components and printed circuit boards) appears on 324 US grants and 299 published applications in this corpus.
Search patents in G01R- Granted patents
- 324
- Published applications
- 299
- Assignees
- 208
- Inventors
- 748
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 6 | 0 |
| 1997 | 8 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 11 | 0 |
| 2001 | 9 | 3 |
| 2002 | 7 | 6 |
| 2003 | 8 | 6 |
| 2004 | 9 | 10 |
| 2005 | 11 | 12 |
| 2006 | 8 | 16 |
| 2007 | 9 | 12 |
| 2008 | 7 | 16 |
| 2009 | 13 | 7 |
| 2010 | 10 | 8 |
| 2011 | 11 | 10 |
| 2012 | 7 | 16 |
| 2013 | 12 | 11 |
| 2014 | 10 | 19 |
| 2015 | 10 | 13 |
| 2016 | 13 | 7 |
| 2017 | 12 | 11 |
| 2018 | 10 | 14 |
| 2019 | 7 | 16 |
| 2020 | 13 | 21 |
| 2021 | 20 | 15 |
| 2022 | 19 | 15 |
| 2023 | 10 | 10 |
| 2024 | 9 | 9 |
| 2025 | 12 | 12 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods to diagnose connectivity of a non-soldered compression USB connector8 Sep 2026US 12,731,923 B2Dell Products L. P.
- Electronic device for inspecting cable, and inspection method25 Aug 2026US 12,716,928 B2Samsung Electronics Co., Ltd.
- Method and apparatus for monitoring the condition of a power semiconductor module7 Jul 2026US 12,674,833 B2ABB Schweiz AG
- Display device for detecting bonding defects9 Jun 2026US 12,650,710 B2LG Display Co., Ltd.
- Detecting output inductor opened for buck converter9 Jun 2026US 12,651,967 B2Mediatek Inc.
- In-field advanced interconnect verify scheme2 Jul 2026US 2026/0186078 A1Micron Technology, Inc.
- Adjustable Adapter for Network Device Connector25 Jun 2026US 2026/0177643 A1Arista Networks, Inc.
- Failure detection system and method21 May 2026US 2026/0140227 A1NXP B. V.
- Solder contact resistance/resistivity testing structure26 Feb 2026US 2026/0060042 A1International Business Machines Corporation
- Interconnection structure impedance measurement circuit and measurement device, and measurement method18 Dec 2025US 2025/0383385 A1Sanechips Technology Co., Ltd.
Most cited
By later US patents
- Method of manufacturing and testing an electronic device, and an electronic device285US 6,167,614 AMicron Technology, Inc. · 2001
- Printed circuit board tester using magnetic induction92US 5,631,572 ATeradyne, Inc. · 1997
- Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device84US 5,828,128 AFujitsu Limited · 1998
- Identification of pin-open faults by capacitive coupling through the integrated circuit package73US 5,124,660 AHewlett-Packard Company · 1992
- Identification of pin-open faults by capacitive coupling through the integrated circuit package67US 5,254,953 AHewlett-Packard Company · 1993