Identification of pin-open faults by capacitive coupling through the integrated circuit package
AssigneeHewlett-Packard Company
InventorsDavid T. Crook, Kevin W. Keirn, Ugur Cilingiroglu
Life of this patent
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Abstract
Disclosed is a system that determines whether input and output pins of semiconductor components are present and properly soldered to a printed circuit board. The system uses an oscillator which supplies a signal, typically ten kilohertz (10 kHz) at 0.2 volts, to the pin under test. A conductive electrode is placed on top of the component package. The electrode is connected to a current measuring device. Another pin of the component is connected to the common signal return. Typically the other pin is chosen to be a power or ground pin of the component.
Claims19
A system for measuring the integrity of an electrical contact between a first electrical connection pin of an electrical component and a trace of a circuit assembly, said system comprising:
- (a) signal supplying means, comprising an output and a common signal return, for supplying an electrical signal via said output to said trace of the circuit assembly;
- (b) an electrical connection between a second connection pin of said electrical component and said common signal return of said signal supplying means;
- (c) a conductive electrode comprising a surface adapted to be placed in a fixed position in proximity to a surface of said first pin;
- and
- (d) measuring means, operatively coupled to said conductive electrode, for measuring a parameter indicative of a capacitance associated with connection of said first pin to said circuit assembly, said capacitance being indicative of the integrity of the electrical connection between said first pin and said trace of said circuit assembly.
A system for measuring the integrity of an electrical contact between a first electrical connection pin of an electrical component and a trace of a circuit assembly, said system comprising:
- (a) signal supplying means, comprising an output and a common signal return, for supplying an electrical signal via said output;
- (b) an electrical connection between a second connection pin of said electrical component and said common signal return of said signal supplying means;
- (c) a conductive electrode, coupled to said output of said signal supplying means, comprising a surface adapted to be placed in a fixed position in proximity to a surface of said first pin;
- and
- (d) measuring means, operatively coupled to said first pin, for measuring a parameter indicative of a capacitance associated with the connection of said first pin to said circuit assembly, said capacitance being indicative of the integrity of the electrical connection between said first pin and said trace of said circuit assembly.
A method for measuring the integrity of an electrical contact between a first electrical connection pin of an electrical component and a trace of a circuit assembly, said method comprising:
- (a) supplying an electrical signal to said trace of the circuit assembly;
- (b) positioning a conductive electrode in a fixed position in proximity to a surface of said first pin;
- (c) measuring a parameter indicative of a capacitance associated with connection of said first pin to said circuit assembly, said capacitance being indicative of the integrity of the electrical connection between said first pin and said trace of said circuit assembly;
- and
- (d) attenuating spurious electrical signals which may inject capacitively into the electrode through pins of said electrical component other than said first pin.
Dependencies are inferred from the claim text.