Substrate and semiconductor package
AssigneesSony Semiconductor Solutions Corporation, Sony Group Corporation
InventorsHirohito Miyazaki, Yuji Nishida, Christopher Wright, Bernadette Elliott-Bowman, Timothy Beard
Life of this patent
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Abstract
Damage to a joint part of a terminal of an electronic component mounted on a substrate is detected. The substrate includes a base material unit, a land, and a light detection unit. The land included in the substrate is arranged with a stress light emitting body configured to emit light in accordance with stress, includes a transparent member, and is joined with a terminal of an element arranged in the base material unit included in the substrate. The light detection unit included in the substrate is arranged between the base material unit and the land included in the substrate, and detects light from the stress light emitting body.
Claims15
A substrate, comprising:
- a base material unit;
- a first land that includes:
- a stress light emitting body configured to emit light based on stress between the substrate and an element;
- and
- a transparent member joined with a terminal of the element;
- a light detection unit between the base material unit and the first land, wherein the light detection unit is configured to detect the light from the stress light emitting body;
- a stress detection unit that includes a damage detection unit, wherein the stress detection unit is configured to detect the stress in the first land based on a first detection result of the detection of the light by the light detection unit;
- and
- the damage detection unit configured to detect damage of a joint part between the terminal and the first land based on the detected stress.
A semiconductor package, comprising:
- a substrate;
- a semiconductor mountable on the substrate, wherein the semiconductor includes a plurality of terminals, a resin body, and a transparent body on the resin body;
- a first stress light emitting body configured to emit light based on a damage of a terminal of the plurality of terminals of the semiconductor;
- and
- a second stress light emitting body in contact with an outside of each of the resin body and the transparent body, wherein
- the second stress light emitting body is configured to emit light based on a damage of a package of the semiconductor, and
- the light emitted by the second stress light emitting body is detectable from outside of the semiconductor package.
Dependencies are inferred from the claim text.