Solder ball detecting device, printed circuit board, radar chip and electronic equipment
AssigneeCalterah Semiconductor Technology (Shanghai) Co., Ltd.
InventorsZhengdong LIU, Wenting ZHOU
Life of this patent
Estimating the term…
Abstract
Provided are a solder ball detecting device, a radar sensor, a radar chip and an electronic equipment. A signal pin of a radar chip is fixed to a printed circuit board by a solder ball. The solder ball detecting device include: a sampling unit, configured to collect a sampled signal from a circuit loop that includes the solder ball; and a detecting unit, configured to detect the sampled signal and to output state information reflecting a welding state of the solder ball based on the sampled signal, where the radar chip is configured to transmit critical signals of the related to object detection via the signal pin and the solder ball.
Claims20
A solder ball detecting device, configured to be electrically connected to a solder ball and to detect a welding state of the solder ball that fixes a signal pin of a radar chip to a printed circuit board, the solder ball detecting device comprising:
- a sampling unit, configured to collect a sampled signal from a circuit loop that includes the solder ball;
- and
- a detecting unit, configured to detect the sampled signal and to output state information reflecting the welding state of the solder ball based on the sampled signal;
- wherein the radar chip is configured to transmit a critical signal related to object detection via the signal pin and the solder ball.
A radar sensor, comprising:
- a radar chip;
- a solder ball, configured to fix the radar chip on a printed circuit board;
- and
- a solder ball detecting device, electrically connected to the solder ball and configured to detect a welding state of the solder ball, a signal pin of the radar chip being fixed to the printed circuit board by the solder ball, the solder ball detecting device comprising:
- a sampling unit, configured to collect a sampled signal from a circuit loop in which the solder ball is located;
- and
- a detecting unit, configured to detect the sampled signal to output state information reflecting the welding state of the solder ball;
- wherein the radar chip is configured to transmit a critical signal related to object detection via the signal pin and the solder ball.
A radar chip, comprising:
- a solder ball detecting device;
- wherein the solder ball detecting device is electrically connected to a solder ball of the radar chip, and includes:
- a sampling unit, configured to collect a sampled signal from a circuit loop in which the solder ball is located;
- and
- a detecting unit, configured to detect the sampled signal to output state information reflecting a welding state of the solder ball;
- wherein the radar chip is configured to transmit a critical signal related to object detection via the signal pin and the solder ball.
Dependencies are inferred from the claim text.