G01R 31/311
Of integrated circuits
Official title: of integrated circuits {(G01R31/31728 takes precedence)}
G01R31/311 (Of integrated circuits) appears on 839 US grants and 674 published applications in this corpus.
Search patents in G01R- Granted patents
- 839
- Published applications
- 674
- Assignees
- 316
- Inventors
- 1,517
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 10 | 0 |
| 1995 | 22 | 0 |
| 1996 | 13 | 0 |
| 1997 | 19 | 0 |
| 1998 | 22 | 0 |
| 1999 | 25 | 0 |
| 2000 | 27 | 0 |
| 2001 | 30 | 10 |
| 2002 | 48 | 28 |
| 2003 | 42 | 30 |
| 2004 | 45 | 37 |
| 2005 | 38 | 41 |
| 2006 | 41 | 44 |
| 2007 | 28 | 32 |
| 2008 | 38 | 30 |
| 2009 | 16 | 29 |
| 2010 | 23 | 24 |
| 2011 | 18 | 20 |
| 2012 | 11 | 15 |
| 2013 | 16 | 15 |
| 2014 | 14 | 25 |
| 2015 | 21 | 24 |
| 2016 | 15 | 18 |
| 2017 | 28 | 26 |
| 2018 | 21 | 24 |
| 2019 | 32 | 22 |
| 2020 | 27 | 30 |
| 2021 | 29 | 37 |
| 2022 | 24 | 27 |
| 2023 | 23 | 25 |
| 2024 | 26 | 21 |
| 2025 | 28 | 27 |
| 2026 | 9 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laser perturbation probing1 Sep 2026US 12,724,062 B2Advanced Micro Devices, Inc.
- Laser-induced hot carrier injection (HCI) for accelerated aging of integrated circuits11 Aug 2026US 12,704,545 B2Intel Corporation
- Use of electromagnetic signature to determine the type of integrated circuit9 Jun 2026US 12,650,461 B2Ohio State Innovation Foundation
- Device for detecting optical loss21 Apr 2026US 12,607,539 B2Msscorps Co., Ltd.
- Technologies for verifying and validating electronic devices using electroluminescence17 Mar 2026US 12,578,383 B2Battelle Memorial Institute
- Inspection method, inspection apparatus, and inspection system17 Sep 2026US 2026/0276703 A1Tokyo Electron Limited
- Test apparatus having probe card with optical test elements and related methods10 Sep 2026US 2026/0266872 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for testing a packaging substrate, and apparatus for testing a packaging substrate13 Aug 2026US 2026/0235700 A1
- Method of detecting defective semiconductor package13 Aug 2026US 2026/0237054 A1Samsung Electronics Co., Ltd.
- Optical coupling verification method23 Jul 2026US 2026/0211032 A1Hermes Testing Solutions Inc.
Most cited
By later US patents
- Laser imaging system for inspection and analysis of sub-micron particles219US 5,479,252 AUltrapointe Corporation · 1995
- Test analysis apparatus and analysis method for semiconductor wafer using OBIC analysis203US 5,493,236 AMitsubishi Denki Kabushiki Kaisha · 1996
- Method and apparatus for optical inspection of substrates183US 4,877,326 AKLA Instruments Corporation · 1989
- Electronic control of an automatic wafer inspection system169US 4,644,172 AKLA Instruments Corporation · 1987
- Infrared receiver wafer level probe testing165US 5,631,571 AThe United States of America as represented by the Secretary of the Air Force · 1997