Test apparatus having probe card with optical test elements and related methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChiu-Yu TSENG, Cheng-Chung CHIU, Guang-Sing HUANG, Kai-Yi TANG
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChiu-Yu TSENG, Cheng-Chung CHIU, Guang-Sing HUANG, Kai-Yi TANG
Estimating the term…
A method is provided. The method includes: extending a probe of a probe card assembly to contact an electrical bump of an integrated circuit (IC) die, the IC die including a silicon photonic element thereon; extending an optical fiber of the probe card assembly to contact the silicon photonic element; and performing an electrooptical test on the IC die by a test head in electrical communication with the probe card assembly, including: transmitting a first test signal from the test head to the electrical bump via the probe, the first test signal being an electrical test signal; transmitting a second test signal via the probe card assembly to the silicon photonic element, the second test signal being an optical test signal.
A method, comprising:
A method comprising:
A system, comprising:
Dependencies are inferred from the claim text.