G01R 31/3025
Wireless interface with the dut
Official title: {Wireless interface with the DUT}
G01R31/3025 (Wireless interface with the dut) appears on 334 US grants and 360 published applications in this corpus.
Search patents in G01R- Granted patents
- 334
- Published applications
- 360
- Assignees
- 144
- Inventors
- 616
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 3 |
| 2002 | 6 | 9 |
| 2003 | 3 | 3 |
| 2004 | 8 | 6 |
| 2005 | 7 | 15 |
| 2006 | 7 | 20 |
| 2007 | 15 | 18 |
| 2008 | 10 | 13 |
| 2009 | 11 | 24 |
| 2010 | 18 | 22 |
| 2011 | 19 | 27 |
| 2012 | 12 | 13 |
| 2013 | 14 | 12 |
| 2014 | 20 | 16 |
| 2015 | 25 | 18 |
| 2016 | 14 | 14 |
| 2017 | 20 | 13 |
| 2018 | 14 | 14 |
| 2019 | 12 | 19 |
| 2020 | 19 | 10 |
| 2021 | 17 | 19 |
| 2022 | 13 | 12 |
| 2023 | 15 | 14 |
| 2024 | 8 | 8 |
| 2025 | 11 | 16 |
| 2026 | 5 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Testing apparatus for high-rate transmission and reception of signals between device under test and semiconductor testing apparatus29 Sep 2026US 12,748,144 B2Advantest Corporation
- Test load board11 Aug 2026US 12,704,546 B2Texas Instruments Incorporated
- Interface to full and reduced pin JTAG devices9 Jun 2026US 12,650,466 B2Texas Instruments Incorporated
- GRPC-based chip test method, GRPC-based chip test apparatus, and storage medium10 Feb 2026US 12,546,822 B2Beijing ESWIN Computing Technology Co., Ltd.
- Evaluation device of radio communication module20 Jan 2026US 12,529,718 B2Fujikura Ltd.
- Semiconductor device, testing system, and method for testing device under test on semiconductor wafer9 Apr 2026US 2026/0101725 A1AP Memory Technology Corp.
- Systems, devices, and methods for performing a non-contact electrical measurement on a cell, non-contact electrical measurement cell vehicle, chip, wafer, die, or logic block8 Jan 2026US 2026/0009845 A1PDF Solutions, Inc.
- Method and apparatus for detection of counterfeit parts, compromised or tampered components or devices, tampered systems such as local communication networks, and for secure identification of components13 Nov 2025US 2025/0347742 A1Palitronica Inc.
- Semiconductor wafer testing apparatus25 Sep 2025US 2025/0298055 A1Kioxia Corporation
- Antenna device and an automated test equipment with a ridged blind mating waveguide flange25 Sep 2025US 2025/0298077 A1Advantest Corporation
Most cited
By later US patents
- Method and apparatus for wireless radio frequency testing of RFID integrated circuits290US 6,236,223 B1Intermec IP Corp. · 2001
- Apparatus for non-conductively interconnecting integrated circuits using half capacitors233US 5,629,838 APolychip, Inc. · 1997
- Capacitively-coupled test probe153US 5,274,336 AHewlett-Packard Company · 1993
- Non-contact test system for determining whether electronic device structures contain manufacturing faults148US 9,372,228 B2Apple Inc. · 2016
- Inspection system, inspection method, and method for manufacturing semiconductor device145US 7,112,952 B2Semiconductor Energy Laboratory Co.Ltd. · 2006