G01R 31/265
Contactless testing
Official title: Contactless testing {(of circuits, also in wafer-form G01R31/302)}
G01R31/265 (Contactless testing) appears on 497 US grants and 362 published applications in this corpus.
Search patents in G01R- Granted patents
- 497
- Published applications
- 362
- Assignees
- 277
- Inventors
- 1,039
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 6 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 7 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 7 | 0 |
| 1985 | 5 | 0 |
| 1986 | 10 | 0 |
| 1987 | 12 | 0 |
| 1988 | 7 | 0 |
| 1989 | 21 | 0 |
| 1990 | 11 | 0 |
| 1991 | 6 | 0 |
| 1992 | 8 | 0 |
| 1993 | 4 | 0 |
| 1994 | 0 | 0 |
| 1995 | 12 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 4 | 0 |
| 2000 | 10 | 0 |
| 2001 | 6 | 1 |
| 2002 | 11 | 10 |
| 2003 | 10 | 7 |
| 2004 | 7 | 6 |
| 2005 | 9 | 9 |
| 2006 | 7 | 9 |
| 2007 | 4 | 7 |
| 2008 | 10 | 5 |
| 2009 | 1 | 2 |
| 2010 | 12 | 11 |
| 2011 | 3 | 6 |
| 2012 | 6 | 8 |
| 2013 | 4 | 14 |
| 2014 | 9 | 16 |
| 2015 | 14 | 28 |
| 2016 | 12 | 18 |
| 2017 | 20 | 19 |
| 2018 | 22 | 21 |
| 2019 | 22 | 17 |
| 2020 | 14 | 22 |
| 2021 | 18 | 27 |
| 2022 | 23 | 24 |
| 2023 | 22 | 21 |
| 2024 | 23 | 20 |
| 2025 | 22 | 19 |
| 2026 | 12 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Laser perturbation probing1 Sep 2026US 12,724,062 B2Advanced Micro Devices, Inc.
- Laser-induced hot carrier injection (HCI) for accelerated aging of integrated circuits11 Aug 2026US 12,704,545 B2Intel Corporation
- Dynamic low and high-frequency device characterization28 Jul 2026US 12,693,327 B1Anritsu Corporation
- Substrate inspection apparatus and method of inspecting a substrate using the same14 Jul 2026US 12,681,072 B2Samsung Electronics Co., Ltd.
- Method of analyzing semiconductor structure7 Jul 2026US 12,674,835 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate inspection apparatus and method of inspecting a substrate using the same1 Oct 2026US 2026/0299005 A1Samsung Electronics Co., Ltd.
- Evaluation and performance analysis of discrete fets in parallel configurations for power applications1 Oct 2026US 2026/0299006 A1
- Semiconductor device20 Aug 2026US 2026/0243815 A1Fuji Electric Co., Ltd.
- Semiconductor sample evaluation method, semiconductor sample evaluation device and semiconductor wafer manufacturing method6 Aug 2026US 2026/0231734 A1Sumco Corporation
- Method for selecting a plurality of target scan rows on a wafer16 Jul 2026US 2026/0202459 A1United Semiconductor (Xiamen) Co., Ltd.
Most cited
By later US patents
- Test analysis apparatus and analysis method for semiconductor wafer using OBIC analysis203US 5,493,236 AMitsubishi Denki Kabushiki Kaisha · 1996
- Non-contact test system for determining whether electronic device structures contain manufacturing faults148US 9,372,228 B2Apple Inc. · 2016
- Apparatus for making surface photovoltage measurements of a semiconductor139US 4,891,584 ASemitest, Inc. · 1990
- Method and apparatus for evaluating surface and subsurface features in a semiconductor127US 4,854,710 ATherma-Wave, Inc. · 1989
- Non-linear light-emitting load current control125US 6,285,139 B1GELcore, LLC · 2001