G01R 3/00
Apparatus or processes specially adapted for the manufacture or maintenance of measuring
Official title: Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips}
G01R3/00 (Apparatus or processes specially adapted for the manufacture or maintenance of measuring) appears on 1,505 US grants and 1,773 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,505
- Published applications
- 1,773
- Assignees
- 596
- Inventors
- 2,592
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 11 | 0 |
| 1997 | 18 | 0 |
| 1998 | 28 | 0 |
| 1999 | 32 | 0 |
| 2000 | 33 | 0 |
| 2001 | 51 | 27 |
| 2002 | 48 | 69 |
| 2003 | 69 | 82 |
| 2004 | 62 | 87 |
| 2005 | 61 | 78 |
| 2006 | 65 | 102 |
| 2007 | 63 | 100 |
| 2008 | 64 | 142 |
| 2009 | 65 | 79 |
| 2010 | 67 | 84 |
| 2011 | 55 | 63 |
| 2012 | 52 | 54 |
| 2013 | 38 | 78 |
| 2014 | 43 | 81 |
| 2015 | 57 | 73 |
| 2016 | 70 | 61 |
| 2017 | 61 | 54 |
| 2018 | 62 | 41 |
| 2019 | 47 | 53 |
| 2020 | 52 | 36 |
| 2021 | 38 | 46 |
| 2022 | 38 | 40 |
| 2023 | 29 | 50 |
| 2024 | 37 | 81 |
| 2025 | 35 | 55 |
| 2026 | 29 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- System and method for automatic probe card replacement22 Sep 2026US 12,742,797 B1InZiv Ltd.
- Electroluminescence inspection apparatus with elastic cores25 Aug 2026US 12,716,934 B2Samsung Electronics Co., Ltd.
- Replaceable insulator collars for semiconductor test systems18 Aug 2026US 12,710,448 B2Xcerra Corporation
- Prefabricated rubber socket11 Aug 2026US 12,704,526 B2
- Semiconductor test key structure and test method of semiconductor structure4 Aug 2026US 12,699,126 B2United Semiconductor (Xiamen) Co., Ltd.
- Cantilever holder structure with attached electrical components for a cantilever-card assembly and methods of forming the same8 Oct 2026US 2026/0309748 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Mems probe needle structure and related methods1 Oct 2026US 2026/0298981 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Composite interface substrate for a probe card and methods for forming and operating the same1 Oct 2026US 2026/0299017 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Probe card and method for manufacturing probe card17 Sep 2026US 2026/0276676 A1Kabushiki Kaisha Nihon Micronics
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Three dimensional high performance interconnection package422US 5,371,654 AInternational Business Machines Corporation · 1994
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999