Electroluminescence inspection apparatus with elastic cores
AssigneeSamsung Electronics Co., Ltd.
InventorsSungyong Min, Changkyu Chung, Kyungwoon Jang, Daeseok Hwang
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Abstract
An electroluminescence inspection apparatus includes a first substrate, and electrode members arranged at a first surface of the first substrate, and electrically contacted respectively with a chip electrode pad of light emitting diodes arranged at a second substrate based on performing an electroluminescence inspection, wherein an electrode member includes contact protrusions configured to be elastically contacted at a chip electrode member of the light emitting diode based on the first substrate is pressed by the second substrate.
Claims20
An electroluminescence inspection apparatus, comprising:
- a first substrate;
- and
- a plurality of electrode members arranged at a first surface of the first substrate, and electrically contacted respectively with a chip electrode pad of a plurality of light emitting diodes arranged at a second substrate based on performing an electroluminescence inspection,
- wherein one electrode member of the plurality of electrode members comprises a plurality of contact protrusions configured to be elastically contacted at a chip electrode member of a light emitting diode of the plurality of light emitting diodes based on the first substrate being pressed by the second substrate, and
- wherein the first substrate comprises:
- a plurality of first wirings disposed on a front surface of the first substrate, wherein the plurality of first wirings are respectively connected to the plurality of electrode members;
- a plurality of second wirings disposed on a rear surface of the first substrate;
- and
- a plurality of vias or a plurality of side wirings electrically connecting the plurality of first wirings and the plurality of second wirings to each other.
An electroluminescence inspection apparatus, comprising:
- a first substrate;
- a first electrode member arranged at a first surface of the first substrate configured to electrically contact a first chip electrode pad of a light emitting diode of a second substrate;
- and
- a second electrode member disposed at the first surface of the first substrate adjacent to the first electrode member configured to electrically contact a second chip electrode pad of the light emitting diode of the second substrate,
- wherein the first electrode member and the second electrode member are provided with a plurality of contact protrusions configured to elastically change by the first chip electrode pad and the second chip electrode pad based on pressing the first substrate to the second substrate,
- wherein the plurality of contact protrusions are configured to restore to a prior form by elastic force based on separating the second substrate from the first substrate, and
- wherein the first substrate comprises:
- a plurality of first wirings disposed on a front surface of the first substrate, wherein respective first wirings among the plurality of first wirings are respectively connected to the first electrode member and the second electrode member;
- a plurality of second wirings disposed on a rear surface of the first substrate;
- and
- a plurality of vias or a plurality of side wirings electrically connecting the plurality of first wirings and the plurality of second wirings to each other.
Dependencies are inferred from the claim text.