G01P 2015/0862
Being provided with particular means being integrated into a mems accelerometer structure
Official title: {being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system}
G01P2015/0862 (Being provided with particular means being integrated into a mems accelerometer structure) appears on 360 US grants and 458 published applications in this corpus.
Search patents in G01P- Granted patents
- 360
- Published applications
- 458
- Assignees
- 130
- Inventors
- 719
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 1 |
| 2005 | 2 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 1 | 2 |
| 2010 | 1 | 3 |
| 2011 | 1 | 17 |
| 2012 | 8 | 17 |
| 2013 | 10 | 22 |
| 2014 | 13 | 29 |
| 2015 | 20 | 38 |
| 2016 | 17 | 23 |
| 2017 | 31 | 29 |
| 2018 | 19 | 31 |
| 2019 | 32 | 36 |
| 2020 | 28 | 34 |
| 2021 | 36 | 37 |
| 2022 | 34 | 30 |
| 2023 | 38 | 33 |
| 2024 | 27 | 32 |
| 2025 | 18 | 24 |
| 2026 | 17 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G01P 2015/0871Using stopper structures for limiting the travel of the seismic massIndexing code169
- G01P 2015/0882For providing damping of vibrationsIndexing code97
- G01P 2015/0865Using integrated signal processing circuitryIndexing code46
- G01P 2015/0874Using means for preventing stiction of the seismic mass to the substrateIndexing code43
- G01P 2015/088For providing wafer-level encapsulationIndexing code30
- G01P 2015/0868Using self-test structures integrated into the microstructureIndexing code16
- G01P 2015/0877Using integrated interconnect structuresIndexing code11
Recent patents
- Optical displacement sensors8 Sep 2026US 12,730,124 B2Sensibel AS
- Accelerometer with proof mass displacement reduction feature25 Aug 2026US 12,716,912 B2Honeywell International Inc.
- Three-dimensional shock detection using knock sensor and tuning fork11 Aug 2026US 12,704,522 B2Vitesco Technologies USA, LLC
- Inertial sensor21 Jul 2026US 12,687,561 B2Seiko Epson Corporation
- Translational mass accelerometer14 Jul 2026US 12,681,039 B2Honeywell International Inc.
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
- Sensor Module23 Jul 2026US 2026/0210998 A1Seiko Epson Corporation
- Method for the energy-efficient operation of a wireless monitoring sensor and correspondingly arranged monitoring sensor18 Jun 2026US 2026/0168844 A1Balluff GmbH
- Compensation circuit, corresponding device and method18 Jun 2026US 2026/0169025 A1STMicroelectronics International N. V.
- Method and Device for Measuring a Voltage4 Jun 2026US 2026/0153537 A1Northrop Grumman LITEF GmbH
Most cited
By later US patents
- Encapsulated MEMS device and method to form the same254US 8,349,635 B1Silicon Laboratories Inc. · 2013
- Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics153US 8,250,921 B2InvenSense, Inc. · 2012
- MEMS tunneling accelerometer63US 8,347,720 B2Tialinx, Inc. · 2013
- Acceleration sensor and manufacturing method for the same55US 6,772,632 B2Wacoh Corporation · 2004
- MEMS devices and methods of forming the same51US 9,181,083 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015