G01P 2015/088
For providing wafer-level encapsulation
Official title: {for providing wafer-level encapsulation}
G01P2015/088 (For providing wafer-level encapsulation) appears on 30 US grants and 35 published applications in this corpus.
Search patents in G01P- Granted patents
- 30
- Published applications
- 35
- Assignees
- 21
- Inventors
- 58
- Latest grant
- 30 Apr 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 0 | 6 |
| 2012 | 4 | 4 |
| 2013 | 5 | 1 |
| 2014 | 3 | 5 |
| 2015 | 3 | 3 |
| 2016 | 1 | 2 |
| 2017 | 2 | 0 |
| 2018 | 2 | 2 |
| 2019 | 2 | 3 |
| 2020 | 2 | 2 |
| 2021 | 1 | 2 |
| 2022 | 2 | 1 |
| 2023 | 1 | 1 |
| 2024 | 2 | 1 |
By publication year.
Recent patents
- Micro-electro mechanical system device containing a bump stopper and methods for forming the same30 Apr 2024US 11,970,387 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic device, manufacturing method for electronic device, electronic apparatus, and vehicle6 Feb 2024US 11,892,464 B2Seiko Epson Corporation
- Physical quantity sensor, composite sensor, inertial measurement unit, vehicle positioning device, portable electronic device, electronic device, vehicle, traveling supporting system, display device, and manufacturing method for physical quantity sensor28 Mar 2023US 11,614,462 B2Seiko Epson Corporation
- Micromechanical sensor and methods for producing a micromechanical sensor and a micromechanical sensor element8 Nov 2022US 11,493,532 B2Infineon Technologies Dresden GmbH
- Micro-electro mechanical system device containing a bump stopper and methods for forming the same22 Mar 2022US 11,279,611 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Vibration sensor with air venting channels7 Nov 2024US 2024/0369402 A1Sonion Nederland B. V.
- Accelerometer, inertial measurement unit imu, and electronic device24 Aug 2023US 2023/0266360 A1Huawei Technologies Co., Ltd.
- Micro-electro mechanical system device containing a bump stopper and methods for forming the same7 Jul 2022US 2022/0212917 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro mechanical system device containing a bump stopper and methods for forming the same17 Jun 2021US 2021/0179419 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic Device, Manufacturing Method For Electronic Device, Electronic Apparatus, And Vehicle28 Jan 2021US 2021/0025915 A1Seiko Epson Corporation
Most cited
By later US patents
- Encapsulated MEMS device and method to form the same254US 8,349,635 B1Silicon Laboratories Inc. · 2013
- Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics153US 8,250,921 B2InvenSense, Inc. · 2012
- MEMS tunneling accelerometer63US 8,347,720 B2Tialinx, Inc. · 2013
- Vertically integrated MEMS acceleration transducer43US 8,186,221 B2Freescale Semiconductor, Inc. · 2012
- Laterally integrated MEMS sensor device with multi-stimulus sensing36US 8,387,464 B2Freescale Semiconductor, Inc. · 2013