Laterally integrated MEMS sensor device with multi-stimulus sensing

A method of producing a microelectromechanical systems (MEMS) sensor device comprising:

• concurrently forming an electrode element and a sense element from a first material layer on a first side of a substrate, said electrode element positioned at a first location on said first side and said sense element laterally spaced apart from said electrode element and positioned at a second location on said first side;
• concurrently forming a movable element and a reference element spaced apart from said first side of said substrate, said movable element and said reference element being formed from a second material layer, said movable element functioning cooperatively with said electrode element to produce a first sensor, and said reference element overlying said sense element to produce a second sensor;
• and
• creating a cavity at said second location extending through said substrate from a second side of said substrate to expose said sense element to an environment external to said sensor system.

A microelectromechanical systems (MEMS) sensor device comprising:

• a substrate having a first side and a second side that opposes said first side;
• a first sensor disposed on said first side at a first location;
• a second sensor disposed on said first side at a second location, said second sensor comprising a pressure sensor having a diaphragm, and said substrate including a cavity at said second location, said cavity extending through said substrate from said second side to expose said diaphragm to an environment external to said MEMS sensor device, and said diaphragm being movable in response to a pressure stimulus from said environment;
• and
• a cap coupled with said first side of said substrate to form a hermetically sealed chamber in which both of said first sensor and said pressure sensor are located.