Electronic device, manufacturing method for electronic device, electronic apparatus, and vehicle

An electronic device comprising:

• a substrate;
• a functional element disposed on one surface of the substrate;
• a lid body, the functional element being housed in a space covered by the lid body and the substrate, the lid body including:
• a first surface facing the functional element;
• a second surface at an opposite side of the first surface;
• a first hole section including an inclined surface and a bottom surface on the second surface;
• a second hole section piercing through the lid body between the first surface and the bottom surface of the first hole section and having an inner wall surface;
• and
• a first joining section of the inclined surface and the bottom surface in the first hole section being a first curved surface along a vertical direction in a cross section of the inclined surface and the bottom surface of the first hole section, the lid body containing silicon;
• and
• a sealing member that seals the first hole section communicating with the space,
• wherein a curvature radius of the first curved surface is in a range of 5 nm and 50 μm.