G01P 2015/0865
Using integrated signal processing circuitry
Official title: {using integrated signal processing circuitry}
G01P2015/0865 (Using integrated signal processing circuitry) appears on 46 US grants and 68 published applications in this corpus.
Search patents in G01P- Granted patents
- 46
- Published applications
- 68
- Assignees
- 38
- Inventors
- 157
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 3 |
| 2013 | 0 | 1 |
| 2014 | 0 | 3 |
| 2015 | 4 | 1 |
| 2016 | 1 | 5 |
| 2017 | 3 | 5 |
| 2018 | 3 | 1 |
| 2019 | 3 | 3 |
| 2020 | 0 | 4 |
| 2021 | 3 | 8 |
| 2022 | 6 | 7 |
| 2023 | 9 | 7 |
| 2024 | 5 | 6 |
| 2025 | 3 | 5 |
| 2026 | 5 | 7 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Inertial sensor21 Jul 2026US 12,687,561 B2Seiko Epson Corporation
- Acceleration sensor30 Jun 2026US 12,672,356 B2Rohm Co., Ltd.
- In-sensor shock intensity estimation28 Apr 2026US 12,613,256 B2STMicroelectronics International N. V.
- MEMS device with movable electrode plate and feedback capacitor21 Apr 2026US 12,606,432 B2Zhunmao (Hangzhou) Technology Co.
- Sensor for parallel measurement of pressure and acceleration and use of the sensor in a vehicle battery27 Jan 2026US 12,535,374 B2Infineon Technologies AG
- Sensor Module23 Jul 2026US 2026/0210998 A1Seiko Epson Corporation
- Method for the energy-efficient operation of a wireless monitoring sensor and correspondingly arranged monitoring sensor18 Jun 2026US 2026/0168844 A1Balluff GmbH
- Compensation circuit, corresponding device and method18 Jun 2026US 2026/0169025 A1STMicroelectronics International N. V.
- Method for suppressing vibration coupled signals in a microphone for flight recorders4 Jun 2026US 2026/0156411 A1L3 Technologies, Inc.
- Method and system for sensor based classification2 Apr 2026US 2026/0092949 A1InvenSense, Inc.
Most cited
By later US patents
- Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics153US 8,250,921 B2InvenSense, Inc. · 2012
- Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics12US 8,997,564 B2InvenSense, Inc. · 2015
- Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope7US 9,726,689 B1Hanking Electronics, Ltd. · 2017
- Extracting inertial information from nonlinear periodic signals7US 9,989,553 B2Lumedyne Technologies Incorporated · 2018
- Signal processing for MEMS capacitive transducers6US 9,716,945 B2Cirrus Logic International Semiconductor Ltd. · 2017