G01N 23/227
Measuring photoelectric effect
Official title: Measuring photoelectric effect, e.g. photoelectron emission microscopy [PEEM]
G01N23/227 (Measuring photoelectric effect) appears on 240 US grants and 264 published applications in this corpus.
Search patents in G01N- Granted patents
- 240
- Published applications
- 264
- Assignees
- 179
- Inventors
- 662
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 5 |
| 2003 | 2 | 3 |
| 2004 | 5 | 3 |
| 2005 | 3 | 5 |
| 2006 | 0 | 10 |
| 2007 | 8 | 8 |
| 2008 | 8 | 7 |
| 2009 | 6 | 5 |
| 2010 | 3 | 0 |
| 2011 | 9 | 5 |
| 2012 | 1 | 5 |
| 2013 | 7 | 9 |
| 2014 | 6 | 9 |
| 2015 | 5 | 8 |
| 2016 | 7 | 9 |
| 2017 | 7 | 10 |
| 2018 | 6 | 14 |
| 2019 | 7 | 11 |
| 2020 | 12 | 21 |
| 2021 | 9 | 19 |
| 2022 | 15 | 24 |
| 2023 | 15 | 20 |
| 2024 | 16 | 22 |
| 2025 | 19 | 21 |
| 2026 | 10 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Patterned X-ray emitting target29 Sep 2026US 12,749,642 B2Nova Measuring Instruments Ltd.
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Electron beam application apparatus and inspection method25 Aug 2026US 12,719,008 B2Hitachi High-Tech Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- In situ and tunable deposition of a film16 Jun 2026US 12,655,515 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for measuring defects in two-component compound wafer and apparatus thereof8 Oct 2026US 2026/0309655 A1SK Siltron Co., Ltd.
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Reliable non-destructive determination of sample parameter values24 Sep 2026US 2026/0287529 A1SPECS Surface Nano Analysis GmbH
- Production solutions for high-throughput/precision xps metrology using unsupervised machine learning27 Aug 2026US 2026/0251594 A1Nova Measuring Instruments Ltd.
- Systems and methods for petahertz optoelectronics13 Aug 2026US 2026/0235539 A1Georg-August-Universität Göttingen Stiftung Öffentlichen Rechts
Most cited
By later US patents
- Thiol labeling of DNA for attachment to gold surfaces400US 5,472,881 AUniversity of Utah Research Foundation · 1995
- Nondestructive characterization of thin films using measured basis spectra58US 6,800,852 B2ReVera Incorporated · 2004
- Decomposition of multi-energy scan projections using multi-step fitting56US 7,197,172 B1Analogic Corporation · 2007
- Method of nano thin film thickness measurement by auger electron spectroscopy52US 7,582,868 B2SAE Magnetics (H. K.) Ltd. · 2009
- X-ray photoelectron emission spectrometry system47US 5,280,176 AThe United States of America as represented by the Secretary of Commerce · 1994