G01N 23/2276
Using the auger effect
Official title: using the Auger effect, e.g. Auger electron spectroscopy [AES]
G01N23/2276 (Using the auger effect) appears on 28 US grants and 26 published applications in this corpus.
Search patents in G01N- Granted patents
- 28
- Published applications
- 26
- Assignees
- 20
- Inventors
- 68
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 2 |
| 2009 | 5 | 1 |
| 2010 | 2 | 0 |
| 2011 | 2 | 2 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 3 |
| 2021 | 2 | 3 |
| 2022 | 1 | 1 |
| 2023 | 3 | 1 |
| 2024 | 1 | 5 |
| 2025 | 0 | 2 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Bonding wire for semiconductor devices10 Dec 2024US 12,166,006 B2Nippon Micrometal Corporation
- Methods of inspecting samples with multiple beams of charged particles14 Nov 2023US 11,815,473 B2ASML Netherlands B. V.
- Analysis method and analysis apparatus11 Jul 2023US 11,698,336 B2JEOL Ltd.
- Bonding wire for semiconductor devices4 Dec 2025US 2025/0372565 A1Nippon Micrometal Corporation
- Method of assessing a sample, apparatus for assessing a sample10 Apr 2025US 2025/0116587 A1ASML Netherlands B. V.
- Bonding wire for semiconductor devices5 Sep 2024US 2024/0297142 A1Nippon Micrometal Corporation
- Bonding wire for semiconductor devices29 Aug 2024US 2024/0290743 A1Nippon Micrometal Corporation
- Bonding wire for semiconductor devices29 Aug 2024US 2024/0290745 A1Nippon Micrometal Corporation
Most cited
By later US patents
- Method of nano thin film thickness measurement by auger electron spectroscopy52US 7,582,868 B2SAE Magnetics (H. K.) Ltd. · 2009
- Quality monitor and monitoring technique employing optically stimulated electron emmission21US 5,393,980 AThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration · 1995
- Method of measuring resist pattern17US 4,670,650 AHitachi, Ltd. · 1987
- Apparatus and method for reducing topographical effects in an auger image13US 4,638,446 AThe Perkin-Elmer Corporation · 1987
- High-resolution auger electron spectrometer11US 7,560,691 B1KLA-Tencor Technologies Corporation · 2009