G01N 21/9505
Wafer internal defects
Official title: {Wafer internal defects, e.g. microcracks}
G01N21/9505 (Wafer internal defects) appears on 372 US grants and 443 published applications in this corpus.
Search patents in G01N- Granted patents
- 372
- Published applications
- 443
- Assignees
- 208
- Inventors
- 1,069
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 3 |
| 2003 | 4 | 2 |
| 2004 | 3 | 4 |
| 2005 | 2 | 5 |
| 2006 | 3 | 7 |
| 2007 | 4 | 11 |
| 2008 | 2 | 6 |
| 2009 | 4 | 6 |
| 2010 | 9 | 17 |
| 2011 | 6 | 18 |
| 2012 | 11 | 19 |
| 2013 | 15 | 11 |
| 2014 | 10 | 17 |
| 2015 | 15 | 17 |
| 2016 | 14 | 12 |
| 2017 | 14 | 15 |
| 2018 | 18 | 24 |
| 2019 | 18 | 33 |
| 2020 | 32 | 26 |
| 2021 | 25 | 35 |
| 2022 | 22 | 35 |
| 2023 | 23 | 19 |
| 2024 | 31 | 42 |
| 2025 | 36 | 42 |
| 2026 | 21 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods and systems for nanoscale imaging based on second harmonic signal generation and through-focus scanning optical microscopy11 Aug 2026US 12,704,465 B2KLA Corporation
- Simultaneous multi-bandwidth optical inspection of semiconductor devices4 Aug 2026US 12,701,970 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for measuring depth of damaged layer and concentration of defects in damaged layer, and system for performing same method28 Jul 2026US 12,693,238 B2Ehwa Diamond Industrial Co., Ltd.
- Bonding energy measurement21 Jul 2026US 12,687,485 B2Tokyo Electron Limited
- Method of evaluating silicon single-crystal ingot, method of evaluating silicon epitaxial wafer, method of manufacturing silicon epitaxial wafer, and method of evaluating silicon mirror polished wafer23 Jun 2026US 12,663,383 B2Sumco Corporation
- Light irradiation type heat treatment method and heat treatment apparatus6 Aug 2026US 2026/0231742 A1SCREEN Holdings Co., Ltd.
- Photoluminescence imaging inspection system for multi-junction solar cells23 Jul 2026US 2026/0210862 A1Livestrong Optoelectronics Co., Ltd.
- Crack detection device and crack detection method9 Jul 2026US 2026/0194462 A1Samsung Electronics Co., Ltd.
- Semiconductor devices with protective layers that facilitate detection of microcracks9 Jul 2026US 2026/0194472 A1SanDisk Technologies LLC
- Measurement system and method based on femtosecond laser9 Jul 2026US 2026/0194473 A1Korea Advanced Institute of Science and Technology
Most cited
By later US patents
- Apparatus and a method for high numerical aperture microscopic examination of materials158US 5,220,403 AInternational Business Machines Corporation · 1993
- Method and apparatus for evaluating ion implant dosage levels in semiconductors118US 5,074,669 ATherma-Wave, Inc. · 1991
- Surface analysis system and method113US 4,893,932 AParticle Measuring Systems, Inc. · 1990
- Apparatus and a method for high numerical aperture microscopic examination of materials102US 5,208,648 AInternational Business Machines Corporation · 1993
- Defect inspection apparatus for silicon wafer49US 6,157,444 AHitachi, Ltd. · 2000