Crack detection device and crack detection method
AssigneeSamsung Electronics Co., Ltd.
InventorsDaeseo PARK, Youngjoo KIM, Musang YOU
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Abstract
A crack detection device includes a stage configured for a semiconductor chip to be loaded or unloaded, and an optical image module configured to irradiate light onto the semiconductor chip and receive the light reflected from the semiconductor chip, wherein the optical image module is further configured to irradiate light into the semiconductor chip, generate an image by receiving the light reflected from the semiconductor chip, and determine whether the generated image includes an interference pattern image.
Claims20
A crack detection device comprising:
- a stage configured for a semiconductor chip to be loaded thereon;
- and
- an optical image module configured to:
- irradiate light onto the semiconductor chip loaded on the stage and receive the light reflected from the semiconductor chip,
- generate an image based on the received light reflected from the semiconductor chip, and
- determine whether the generated image includes an interference pattern image.
A crack detection method comprising:
- loading a semiconductor chip onto a stage;
- irradiating light onto the semiconductor chip;
- generating an image based on light reflected from the semiconductor chip;
- determining whether an interference pattern image is in the generated image;
- and
- based on determining that the interference pattern image is in the generated image, classifying the semiconductor chip as a semiconductor chip including a crack,
- wherein the interference pattern image comprises an image in which bright patterns and dark patterns are alternately arranged.
A crack detection device comprising:
- a stage configured for a semiconductor chip to be loaded thereon;
- an optical image module configured to irradiate light onto the semiconductor chip and receive the light reflected from the semiconductor chip;
- and
- an image analysis module configured to classify images provided from the optical image module into an image including an interference pattern image or an image not including an interference pattern image,
- wherein the optical image module comprises:
- a light source unit configured to irradiate the light into the semiconductor chip;
- an optical system configured to control a path of the light;
- an image sensor unit configured to detect the light reflected from the semiconductor chip and generates an image;
- and
- an image processing unit configured to analyze the generated image,
- wherein the optical image module classifies the generated image into an image including the interference pattern image or an image not including the interference pattern image by using at least one of deep learning and machine learning,
- the interference pattern image is an image in which dark patterns and bright patterns are arranged alternately, and
- the light irradiated onto the semiconductor chip has a wavelength in a range of about 620 nm to about 750 nm.
Dependencies are inferred from the claim text.