Semiconductor devices with protective layers that facilitate detection of microcracks

A semiconductor device assembly, comprising:

• semiconductive means for carrying a plurality of circuits;
• redistribution means for establishing communication between the plurality of circuits and electronic devices external to the semiconductor device;
• and
• protective means for insulating the redistribution means, the protective means comprising fluorescent means for identifying microcracks in the protective means, the fluorescent means dispersed throughout the protective means, bonding means for establishing communication with an electronic device external to the semiconductor device exposed through the protective means.

A method for detecting a microcrack in a semiconductor device, comprising:

• forming a polyimide with a fluorescent indicator dispersed therethrough;
• applying the polyimide over a metal layers of a plurality of semiconductor devices on a wafer to form a polyimide layer with the fluorescent indicator dispersed therethrough;
• x-ray-imaging at least one semiconductor device of the plurality of semiconductor devices to provide an image of the at least one semiconductor device, any microcrack in the at least one semiconductor device appearing as a dark line in the image;
• and
• visualizing the image to identify the microcrack in the at least one semiconductor device.