G01N 21/9501
Semiconductor wafers
Official title: {Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)}
G01N21/9501 (Semiconductor wafers) appears on 3,864 US grants and 4,249 published applications in this corpus.
Search patents in G01N- Granted patents
- 3,864
- Published applications
- 4,249
- Assignees
- 822
- Inventors
- 6,702
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 8 | 0 |
| 1991 | 9 | 0 |
| 1992 | 5 | 0 |
| 1993 | 10 | 0 |
| 1994 | 9 | 0 |
| 1995 | 10 | 0 |
| 1996 | 8 | 0 |
| 1997 | 14 | 0 |
| 1998 | 24 | 0 |
| 1999 | 26 | 0 |
| 2000 | 38 | 0 |
| 2001 | 38 | 31 |
| 2002 | 56 | 110 |
| 2003 | 107 | 112 |
| 2004 | 110 | 139 |
| 2005 | 91 | 152 |
| 2006 | 143 | 179 |
| 2007 | 136 | 171 |
| 2008 | 153 | 161 |
| 2009 | 126 | 156 |
| 2010 | 154 | 141 |
| 2011 | 116 | 137 |
| 2012 | 125 | 144 |
| 2013 | 126 | 168 |
| 2014 | 137 | 169 |
| 2015 | 167 | 219 |
| 2016 | 162 | 163 |
| 2017 | 190 | 138 |
| 2018 | 157 | 166 |
| 2019 | 198 | 178 |
| 2020 | 192 | 207 |
| 2021 | 171 | 217 |
| 2022 | 158 | 203 |
| 2023 | 170 | 197 |
| 2024 | 168 | 201 |
| 2025 | 202 | 229 |
| 2026 | 120 | 161 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for identifying defects in materially integral connections6 Oct 2026US 12,754,144 B2Fraunhofer Gesselschaft zur Förderung der Angewandten Forschung e. V.
- Lock-in averaging for semiconductor diagnostics6 Oct 2026US 12,754,145 B2Imec Vzw
- Method for fabricating a semiconductor device using a wafer inspection apparatus6 Oct 2026US 12,757,687 B2Samsung Electronics Co., Ltd.
- Optical measurement apparatus and optical measurement method29 Sep 2026US 12,748,039 B2Samsung Electronics Co., Ltd.
- Modular autoencoder model for manufacturing process parameter estimation29 Sep 2026US 12,748,056 B2ASML Netherlands B. V.
- Photodetector inspection apparatus and photodetector inspection method8 Oct 2026US 2026/0309579 A1Mitsubishi Electric Corporation
- Method for suppressing variation in light emission intensity of background in photoluminescence measurement, and evaluation method for semiconductor substrate8 Oct 2026US 2026/0309625 A1Kwansei Gakuin Educational Foundation
- Inspection system for edge and bevel inspection of semiconductor structures8 Oct 2026US 2026/0309638 A1Camtek Ltd.
- Interference observation device and interference observation method8 Oct 2026US 2026/0309643 A1Hamamatsu Photonics K.K.
- Method and apparatus for inspecting a wafer8 Oct 2026US 2026/0311320 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Defect detection system406US 4,314,763 ARCA Corporation · 1982
- Automated defect classification system281US 5,544,256 AInternational Business Machines Corporation · 1996
- Methods and systems for determining a critical dimension and a thin film characteristic of a specimen248US 6,633,831 B2KLA-Tencor Technologies Corporation · 2003
- Sample inspection system235US 6,201,601 B1KLA-Tencor Corporation · 2001
- Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices229US 6,771,806 B1KLA-Tencor Corporation · 2004