Method and apparatus for inspecting a wafer

A semiconductor inspection apparatus, comprising:

• a light source configured to emit light;
• a wavefront shaping device configured to shape a wavefront of the light to generate light with a shaped wavefront;
• a beam splitter configured to split the light with the shaped wavefront into a first portion directed to a surface of a wafer to be inspected and a second portion directed to a reference reflector;
• a shutter in a light path between the beam splitter and the reference reflector;
• and
• an imaging apparatus configured to capture an image based upon a reflection beam generated based upon the light with the shaped wavefront being reflected from the wafer, wherein:
• during a first mode of operation, the shutter is configured to allow the second portion of the light with the shaped wavefront to be reflected from the reference reflector and merge with the reflection beam, and
• during a second mode of operation, the shutter is configured to inhibit the second portion of the light with the shaped wavefront from being incident on the reference reflector.

A method, comprising:

• shaping a wavefront of light to provide the light with a shaped wavefront based upon an inspection surface of a wafer upon which the light with the shaped wavefront is to be incident;
• directing the light with the shaped wavefront to an inspection surface of a wafer, causing a reflection beam to be reflected from the inspection surface of the wafer;
• capturing an image formed from the reflection beam reflected from the inspection surface of the wafer and generating image data related to the image;
• and
• analyzing the image data to determine whether there is a defect in the inspection surface of the wafer.