G01J 5/045
Sealings
Official title: {Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements (getter arrangements per se H10W76/48, H10P36/03)}
G01J5/045 (Sealings) appears on 333 US grants and 361 published applications in this corpus.
Search patents in G01J- Granted patents
- 333
- Published applications
- 361
- Assignees
- 202
- Inventors
- 841
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 8 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 9 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 3 |
| 2002 | 3 | 7 |
| 2003 | 5 | 5 |
| 2004 | 5 | 14 |
| 2005 | 6 | 6 |
| 2006 | 6 | 13 |
| 2007 | 7 | 12 |
| 2008 | 11 | 12 |
| 2009 | 6 | 10 |
| 2010 | 13 | 8 |
| 2011 | 5 | 12 |
| 2012 | 5 | 16 |
| 2013 | 14 | 19 |
| 2014 | 11 | 15 |
| 2015 | 11 | 16 |
| 2016 | 18 | 24 |
| 2017 | 17 | 11 |
| 2018 | 19 | 20 |
| 2019 | 20 | 20 |
| 2020 | 16 | 16 |
| 2021 | 16 | 15 |
| 2022 | 13 | 22 |
| 2023 | 13 | 20 |
| 2024 | 17 | 27 |
| 2025 | 13 | 13 |
| 2026 | 11 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a sensor device7 Jul 2026US 12,677,483 B2Melexis Technologies SA
- Sensor bridge assembly23 Jun 2026US 12,663,313 B2Chorusview, Inc.
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Wafer level vacuum packaging (WLVP) of thermal imaging sensor19 May 2026US 12,631,491 B2Meridian Innovation Pte Ltd
- Electromagnetic wave sensor and manufacturing method thereof19 May 2026US 12,631,492 B2TDK Corporation
- Infrared detector and associated production method23 Jul 2026US 2026/0210767 A1Lynred
- Method for the Manufacturing of a Hybrid Component and Associated Hybrid Component25 Jun 2026US 2026/0182430 A1Lynred
- Window cavity wafers4 Jun 2026US 2026/0153380 A1Materion Corporation
- Infrared thermopile sensor30 Apr 2026US 2026/0118182 A1Oriental System Technology Inc.
- Method of manufacturing optical device5 Feb 2026US 2026/0036793 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Infrared detector182US 5,914,488 AMitsubishi Denki Kabushiki Kaisha · 1999
- Molded window array for image sensor packages182US 6,266,197 B1Amkor Technology, Inc. · 2001
- Integrated silicon vacuum micropackage for infrared devices149US 5,895,233 AHoneywell Inc. · 1999
- Diffractive optical modulator and method for producing the same, infrared sensor including such a diffractive optical modulator and method for producing the same, and display device including such a diffractive optical modulator136US 5,920,418 AMatsushita Electric Industrial Co., Ltd. · 1999