Infrared thermopile sensor

An infrared thermopile sensor, comprising:

• an infrared sensing chip, comprising:
• a first substrate, comprising a wire-bonding pad and two membrane structures configured by a front-side wet etching;
• a first thermopile sensing element, disposed on one of the membrane structures and generating an object temperature signal;
• a second thermopile sensing element, disposed on another one of the membrane structures and adjacent to the first thermopile sensing element, and generating a compensation temperature signal;
• and
• a front-end signal processing unit, disposed on the first substrate and electrically connected with the first thermopile sensing element and the second thermopile sensing element;
• a silicon cover, bonded to the infrared sensing chip by a wafer-level bonding, and comprising an infrared Fresnel lens focusing a thermal radiation of an object to the first thermopile sensing element, a size of the silicon cover being smaller than a size of the infrared sensing chip, and the wire-bonding pad exposed from the silicon cover;
• a microcontroller chip, connected with the infrared sensing chip, and configured to receive the object temperature signal (Tb) and the compensation temperature signal, and to compute an estimated air temperature based on an internal temperature signal (Ta), and a pre-measured thermal resistance ratio, and to compute to obtain a temperature adjustment information relative to a predetermined temperature according to the estimated air temperature and a water vapor pressure information, to calculate a first temperature of the object, and to calculate a second temperature of the object according to the first temperature, wherein the water vapor pressure information is preset or imported, the microcontroller chip comprising:
• a second substrate;
• and
• a plurality of through silicon vias (TSVs), disposed in the second substrate;
• a package substrate, configured to carry the microcontroller chip and to receive an output signal or an input signal of the microcontroller chip through the TSVs, and comprising a plurality of contacts disposed on a lower surface thereof, and the TSVs electrically connected to the contacts;
• and
• a sealing encapsulation, configured to cover the package substrate, the microcontroller chip, the infrared sensing chip, and the silicon cover, and an upper surface of the silicon cover being exposed from the sealing encapsulation.