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US 5,895,233 AGranted
Integrated silicon vacuum micropackage for infrared devices
AssigneeHoneywell Inc.
InventorsRobert E. Higashi, Jeffrey A. Ridley, Thomas G. Stratton, R. Andrew Wood
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Abstract
An efficient method brings together two wafers of dies that contain an infrared transparent window or top cap with either an infrared detector or emitter array to produce a low cost infrared package. A low thermal conductivity gas or a vacuum may be used between the wafers for enhanced thermal isolation. Joining of the wafers is preferably by solder, although ultrasonic bonding can be used.
Claims4
A process of making infrared array packages from two wafers comprising:
- a) evacuating a chamber contained by a top cap wafer having top cap dies and also containing an array wafer having array dies located so as to be pairable with said top cap dies;
- b) physically bringing together the two wafers such that the paired arrays and the top caps are positioned so as to be sealable together;
- c) sealing said wafers together;
- d) dicing the paired dies.
1 more element
Dependencies are inferred from the claim text.