C23C 16/4485
By evaporation without using carrier gas in contact with the source material
Official title: {by evaporation without using carrier gas in contact with the source material (C23C16/4486 takes precedence)}
C23C16/4485 (By evaporation without using carrier gas in contact with the source material) appears on 308 US grants and 380 published applications in this corpus.
Search patents in C23C- Granted patents
- 308
- Published applications
- 380
- Assignees
- 209
- Inventors
- 966
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 8 | 0 |
| 1995 | 9 | 0 |
| 1996 | 13 | 0 |
| 1997 | 5 | 0 |
| 1998 | 11 | 0 |
| 1999 | 10 | 0 |
| 2000 | 12 | 0 |
| 2001 | 11 | 6 |
| 2002 | 11 | 10 |
| 2003 | 6 | 13 |
| 2004 | 9 | 7 |
| 2005 | 3 | 14 |
| 2006 | 7 | 14 |
| 2007 | 3 | 2 |
| 2008 | 6 | 13 |
| 2009 | 3 | 12 |
| 2010 | 4 | 13 |
| 2011 | 3 | 22 |
| 2012 | 10 | 6 |
| 2013 | 7 | 13 |
| 2014 | 12 | 17 |
| 2015 | 5 | 13 |
| 2016 | 9 | 7 |
| 2017 | 9 | 14 |
| 2018 | 6 | 10 |
| 2019 | 6 | 14 |
| 2020 | 3 | 10 |
| 2021 | 11 | 22 |
| 2022 | 11 | 25 |
| 2023 | 16 | 28 |
| 2024 | 17 | 29 |
| 2025 | 24 | 23 |
| 2026 | 10 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods and apparatus for solid source refill18 Aug 2026US 12,709,800 B2ASM IP Holding B. V.
- Method of coating a coating region on a front surface of a substrate and apparatus for a thermal evaporation system16 Jun 2026US 12,655,520 B2Max-Planck-Gesellschaft Zur FöRderung Der Wissenschaften E. V.
- Ultra high purity conditions for atomic scale processing28 Apr 2026US 12,614,696 B2Kurt J. Lesker Company
- Precursor supply chamber31 Mar 2026US 12,590,367 B2Beneq Oy
- Tray assemblies for precursor delivery systems and related methods24 Mar 2026US 12,584,217 B2Entegris, Inc.
- Composition containing an organosilane compounds, methods of manufacturing thin films and thin film-coated substrates, transfer method, thin film-coated substrate, and article1 Oct 2026US 2026/0297741 A1Gelest, Inc.
- Ultra High Purity Conditions for Atomic Scale Processing27 Aug 2026US 2026/0253839 A1Kurt J. Lesker Company
- Large scale system for atomic layer deposition13 Aug 2026US 2026/0234803 A1Forge Nano, Inc.
- Systems for controlled precursor delivery to a plurality of deposition chambers and related methods30 Jul 2026US 2026/0218381 A1Entegris, Inc.
- Vapor supply for substrate processing systems9 Jul 2026US 2026/0193778 A1Lam Research Corporation
Most cited
By later US patents
- Precursor source mixtures666US 6,984,591 B1International Business Machines Corporation · 2006
- Apparatus for producing compound semiconductor devices591US 5,496,408 AMitsubishi Denki Kabushiki Kaisha · 1996
- Container for liquid metal organic compound569US 5,589,110 A1996
- Liquid material vaporization apparatus for semiconductor processing apparatus564US 7,833,353 B2ASM Japan K .K. · 2010
- Method of aluminum oxide low pressure chemical vapor deposition (LPCVD) system-fourier transform infrared (FTIR) source chemical control482US 5,665,608 AInternational Business Machines Corporation · 1997