C23C 14/046
Coating cavities or hollow spaces
Official title: {Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates}
C23C14/046 (Coating cavities or hollow spaces) appears on 580 US grants and 571 published applications in this corpus.
Search patents in C23C- Granted patents
- 580
- Published applications
- 571
- Assignees
- 297
- Inventors
- 1,431
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 7 | 0 |
| 1990 | 7 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 12 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 10 | 0 |
| 1998 | 20 | 0 |
| 1999 | 17 | 0 |
| 2000 | 32 | 0 |
| 2001 | 30 | 8 |
| 2002 | 30 | 14 |
| 2003 | 13 | 19 |
| 2004 | 13 | 20 |
| 2005 | 17 | 36 |
| 2006 | 8 | 27 |
| 2007 | 4 | 24 |
| 2008 | 13 | 20 |
| 2009 | 15 | 32 |
| 2010 | 23 | 19 |
| 2011 | 17 | 12 |
| 2012 | 18 | 21 |
| 2013 | 15 | 14 |
| 2014 | 20 | 26 |
| 2015 | 15 | 30 |
| 2016 | 16 | 19 |
| 2017 | 20 | 25 |
| 2018 | 16 | 16 |
| 2019 | 14 | 24 |
| 2020 | 17 | 38 |
| 2021 | 22 | 25 |
| 2022 | 23 | 27 |
| 2023 | 21 | 25 |
| 2024 | 14 | 15 |
| 2025 | 22 | 21 |
| 2026 | 10 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Reactive-ion deposition processes for dielectric material formation14 Jul 2026US 12,685,043 B2APPLIED Materials.Inc.
- Field suppressed metal gapfill9 Jun 2026US 12,652,972 B2APPLIED Materials.Inc.
- Method of manufacture of precious metal laminate5 May 2026US 12,618,135 B2Valaurum, Inc.
- Seed structures for structured coatings for optical and other devices21 Apr 2026US 12,607,779 B2NIL Technology ApS
- Laminated structure21 Apr 2026US 12,610,662 B2Japan Display Inc.
- Biomimetic transparent nanoplasmonic meshes by reverse-nanoimprint lithography3 Sep 2026US 2026/0259354 A1
- Method for depositing copper thin film in through glass via using atomic sputtering epitaxy27 Aug 2026US 2026/0255981 A1Cit, S.A.
- Methods and systems for filling a gap13 Aug 2026US 2026/0239900 A1ASM IP Holding B. V.
- Metal silicide for contact and methods of forming same18 Jun 2026US 2026/0173472 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Superconducting cavity smoothness14 May 2026US 2026/0136450 A1Fermi Forward Discovery Group, LLC
Most cited
By later US patents
- Method of selective coverage of high aspect ratio structures with a conformal film498US 7,625,820 B1Novellus Systems, Inc. · 2009
- Step coverage and overhang improvement by pedestal bias voltage modulation330US 5,976,327 AAPPLIED Materials.Inc. · 1999
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition228US 6,051,114 AAPPLIED Materials.Inc. · 2000
- Sputter coating process control method and apparatus156US 5,126,028 AMaterials Research Corporation · 1992