C09J 2301/502
Process for debonding adherents
Official title: process for debonding adherents
C09J2301/502 (Process for debonding adherents) appears on 338 US grants and 644 published applications in this corpus.
Search patents in C09J- Granted patents
- 338
- Published applications
- 644
- Assignees
- 240
- Inventors
- 1,303
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 0 |
| 2003 | 1 | 2 |
| 2004 | 3 | 7 |
| 2005 | 2 | 5 |
| 2006 | 0 | 6 |
| 2007 | 1 | 8 |
| 2008 | 4 | 15 |
| 2009 | 5 | 13 |
| 2010 | 9 | 18 |
| 2011 | 9 | 10 |
| 2012 | 5 | 18 |
| 2013 | 5 | 27 |
| 2014 | 16 | 18 |
| 2015 | 10 | 22 |
| 2016 | 6 | 22 |
| 2017 | 14 | 26 |
| 2018 | 23 | 26 |
| 2019 | 18 | 28 |
| 2020 | 25 | 37 |
| 2021 | 18 | 29 |
| 2022 | 22 | 62 |
| 2023 | 30 | 65 |
| 2024 | 27 | 70 |
| 2025 | 45 | 67 |
| 2026 | 36 | 42 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier tape system and methods of making and using the same6 Oct 2026US 12,753,327 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electrically peelable adhesive composition, electrically peelable adhesive product, and utilization thereof6 Oct 2026US 12,753,330 B2Vigteqnos Co., Ltd.
- Epoxy adhesive composition for easy separation for recycling6 Oct 2026US 12,753,332 B2Hyundai Motor Company
- Protective sheet, method for producing electronic component, and method for producing glass piece forming display surface of display apparatus22 Sep 2026US 12,742,100 B2Nitto Denko Corporation
- Laminate, release agent composition, and method for producing processed semiconductor substrate15 Sep 2026US 12,734,784 B2Nissan Chemical Corporation
- Secondary layer assembly for an impact surface and method thereof24 Sep 2026US 2026/0284492 A1Gear Ties LLC D/B/A Xtrudex
- Pressure-sensitive adhesive compound, adhesive tape, bonded assembly and method for electrically debonding the bonded assembly24 Sep 2026US 2026/0286194 A1Tesa SE
- Tape including reactive layer and process for making the tape24 Sep 2026US 2026/0286197 A13M Innovative Properties Company
- Release agent composition for release by irradiation with light, laminate, and method for producing processed semiconductor substrate17 Sep 2026US 2026/0275170 A1Nissan Chemical Corporation
- Semiconductor Device and Method of Making Using Microwave Based Debonding17 Sep 2026US 2026/0282800 A1JCET STATS ChipPAC Korea Limited
Most cited
By later US patents
- Redetachable, self-adhesive hook65US 5,409,189 ABeiersdorf AG · 1995
- Article and method for controlled debonding of elements using shape memory alloy actuators58US 6,773,535 B1The United States of America as represented by the Secretary of the Army · 2004
- Temporary wafer bonding method for semiconductor processing57US 7,541,264 B2Dow Corning Corporation · 2009
- Electrically disbonding materials54US 6,620,308 B2EIC Laboratories, Inc. · 2003
- Method of making thermally removable adhesives38US 6,825,315 B2Sandia Corporation · 2004