Semiconductor Device and Method of Making Using Microwave Based Debonding
AssigneeJCET STATS ChipPAC Korea Limited
InventorsYeojun Yun, Minsung Lee, HeeSoo Lee
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Abstract
A semiconductor device manufacturing process is performed by providing a carrier and disposing an adhesive coating over the carrier. The adhesive coating includes polypropylene carbonate, graphite powder, and a photo acid generator or thermal acid generator. A semiconductor wafer is attached to the carrier using the adhesive coating. Backside processing is performed on the semiconductor wafer while the semiconductor wafer is attached to the carrier. The semiconductor wafer is debonded from the carrier by applying microwave energy to the adhesive coating.
Claims25
A method of making a semiconductor device, comprising:
- providing a carrier;
- disposing an adhesive coating over the carrier, wherein the adhesive coating includes polypropylene carbonate, graphite powder, and a photo acid generator or thermal acid generator;
- attaching a semiconductor wafer to the carrier using the adhesive coating;
- performing backside processing on the semiconductor wafer while the semiconductor wafer is attached to the carrier;
- and
- debonding the semiconductor wafer from the carrier by applying a microwave energy to the adhesive coating.
A method of making a semiconductor device, comprising:
- providing a carrier;
- disposing an adhesive coating over the carrier, wherein the adhesive coating includes polypropylene carbonate and either a photo acid generator or thermal acid generator;
- attaching a semiconductor wafer to the carrier using the adhesive coating;
- and
- debonding the semiconductor wafer from the carrier by applying microwave energy to the adhesive coating.
A method of making a semiconductor device, comprising:
- providing a carrier;
- disposing an adhesive coating over the carrier;
- attaching a semiconductor die to the carrier using the adhesive coating;
- and
- debonding the semiconductor die from the carrier by applying microwave energy to the adhesive coating.
A semiconductor device, comprising:
- a carrier;
- a semiconductor die;
- and
- an adhesive coating disposed between the carrier and semiconductor die, wherein the adhesive coating includes polypropylene carbonate and either a photo acid generator or thermal acid generator.
Dependencies are inferred from the claim text.