Pressure-sensitive adhesive compound, adhesive tape, bonded assembly and method for electrically debonding the bonded assembly

Abstract

The invention relates to a pressure-sensitive adhesive compound, a pressure-sensitive adhesive tape, a bonded assembly, a method for electrically debonding the bonded assembly, and the use of the pressure-sensitive adhesive compound. The pressure-sensitive adhesive compound contains a) at least one crosslinked polyurethane prepared by crosslinking one or more polyurethane prepolymers, at least one of the polyurethane prepolymers being based on at least one polyol which is selected from the group consisting of polyester polyols, polycarbonate polyols and polyether polyols; and b) at least one electrolyte, the electrolyte being selected from the group consisting of ionic liquids and metal salts, ionic liquids being particularly preferred.

Dependencies are inferred from the claim text.