Laminate, release agent composition, and method for producing processed semiconductor substrate

A laminate comprising:

• a semiconductor substrate;
• a support substrate that is light-transmissive;
• and
• an adhesive layer and a release layer provided between the semiconductor substrate and the support substrate,
• the laminate being used when the release layer absorbs light irradiated from a side of the support substrate and then the semiconductor substrate and the support substrate are separated from each other,
• wherein
• the release layer is formed from a release agent composition,
• the release agent composition contains a light-absorbing compound having a molecular weight of 400 g/mol or more and 2,000 g/mol or less,
• the light-absorbing compound has an aromatic hydrocarbon ring having at least one of a hydroxy group and an alkoxy group,
• the light-absorbing compound has 4 or more and 10 or less of the aromatic hydrocarbon rings per molecular weight of 1,000 g/mol, and
• when the light-absorbing compound is measured for an absorption spectrum in a range of 250 to 800 nm, the absorption spectrum has a local maximum value, which is a maximum absorbance in a range of 250 to 800 nm, between 250 nm and 350 nm.