Article and method for controlled debonding of elements using shape memory alloy actuators
AssigneeThe United States of America as represented by the Secretary of the Army
InventorEric D. Wetzel
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AssigneeThe United States of America as represented by the Secretary of the Army
InventorEric D. Wetzel
Estimating the term…
A separable bonding system including two opposed rigid adherends and a deformed shape memory alloy element disposed between and adhesively bonded to facing surfaces of the two rigid adherends. A method of adhesively bonding and selectively debonding and separating at least two rigid adherends including mechanically straining a shape memory alloy element to form a deformed shape memory alloy element; disposing the deformed shape memory alloy element between and adhesively bonding the deformed shape memory alloy element to facing surfaces of at least two rigid adherends; elevating the temperature of the deformed shape memory alloy element sufficient to transform the deformed shape memory alloy element from the mechanically strained state to a recovered shape, thereby weakening adhesive bonds formed between the shape memory alloy element and separating the facing surfaces of the at least two rigid adherends.
A separable bonding system comprising:
A method of adhesively bonding and selectively debonding and separating at least two rigid adherends comprising:
Dependencies are inferred from the claim text.