C08L 79/085
Unsaturated polyimide precursors
Official title: {Unsaturated polyimide precursors}
C08L79/085 (Unsaturated polyimide precursors) appears on 313 US grants and 351 published applications in this corpus.
Search patents in C08L- Granted patents
- 313
- Published applications
- 351
- Assignees
- 162
- Inventors
- 916
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 7 | 0 |
| 1978 | 4 | 0 |
| 1979 | 5 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 4 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 9 | 0 |
| 1993 | 12 | 0 |
| 1994 | 8 | 0 |
| 1995 | 9 | 0 |
| 1996 | 9 | 0 |
| 1997 | 7 | 0 |
| 1998 | 3 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 2 | 2 |
| 2004 | 1 | 3 |
| 2005 | 0 | 3 |
| 2006 | 1 | 1 |
| 2007 | 3 | 5 |
| 2008 | 2 | 3 |
| 2009 | 3 | 9 |
| 2010 | 4 | 16 |
| 2011 | 4 | 6 |
| 2012 | 8 | 13 |
| 2013 | 7 | 11 |
| 2014 | 10 | 13 |
| 2015 | 8 | 7 |
| 2016 | 13 | 11 |
| 2017 | 7 | 7 |
| 2018 | 10 | 20 |
| 2019 | 10 | 17 |
| 2020 | 17 | 17 |
| 2021 | 14 | 30 |
| 2022 | 12 | 29 |
| 2023 | 18 | 36 |
| 2024 | 19 | 31 |
| 2025 | 15 | 35 |
| 2026 | 10 | 25 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable film composition, curable film, and cured product thereof22 Sep 2026US 12,742,059 B2Thintronics, Inc.
- Resin composition and product made therefrom1 Sep 2026US 12,723,155 B2Elite Material Co., Ltd.
- Resin composition and article made therefrom21 Jul 2026US 12,686,767 B2Elite Electronic Material (Kunshan) Co., Ltd.
- Nanocomposite flame retardant, flame retardant bismaleimide resin and preparation method thereof30 Jun 2026US 12,668,681 B2
- Photocurable maleimide resin composition16 Jun 2026US 12,655,254 B2Shin-Etsu Chemical Co., Ltd.
- Maleimide resin, resin composition, cured product, sheet, laminate, and printed wiring board1 Oct 2026US 2026/0297264 A1Resonac Corporation
- Resin composition and article made therefrom1 Oct 2026US 2026/0297327 A1Elite Material Co., Ltd.
- Resin composition, and prepreg and use thereof10 Sep 2026US 2026/0265473 A1Guangdong Hinno-Tech Co., Ltd.
- Resin composition, prepreg, resin film, laminate, printed wiring board, and semiconductor package13 Aug 2026US 2026/0234391 A1Resonac Corporation
- Resin composition and uses of the same13 Aug 2026US 2026/0234399 A1Taiwan Union Technology Corporation
Most cited
By later US patents
- High temperature three dimensional printing compositions65US 9,708,440 B2Novoset, LLC · 2017
- Production of thermoset composites containing thermoplastic fillers62US 4,954,195 ALockheed Corporation · 1990
- Water-insoluble hydrophilic copolymers57US 4,277,582 ACiba-Geigy Corporation · 1981
- Thermosetting resin composition from maleimide compound and alkenyl phenol48US 4,298,720 AMitsui Toatsu Chemicals, Inc. · 1981
- High temperature three-dimensional printing compositions41US 9,873,761 B1Novoset, LLC · 2018