Photocurable maleimide resin composition
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsYoshihiro Tsutsumi, Hiroyuki Iguchi, Yuki Kudo, Atsushi Tsuura, Tadaharu Ikeda
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Abstract
Provided is a photocurable maleimide resin composition that is superior in curability, and is capable of being turned into a cured product having superior dielectric properties, a high glass-transition temperature and a small coefficient of thermal expansion. The photocurable maleimide resin composition contains: (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms; and (B) a photocuring initiator.
Claims10
A photocurable maleimide resin composition for use in an insulation layer of a circuit board in which a copper foil is used to laminate the insulation layer, or in an adhesive for a glass substrate in which the glass substrate is used as at least one surface for an adhesion, comprising:
- (A) a maleimide compound having, per each molecule, at least one saturated or unsaturated divalent aliphatic hydrocarbon group having 6 to 200 carbon atoms;
- (B) a photocuring initiator;
- (C) a polymerization inhibitor;
- and
- (D) an adhesion aid having a functional group reactive with maleimide groups in the component (A), the adhesion aid comprising (a) a silane coupling agent having a maleimide group, (b) a triazole-based compound, (c) or a tetrazole-based compound,
- wherein the photocuring initiator as the component (B) is contained in an amount of 0.1 to 5.0 parts by mass per 100 parts by mass of the component (A);
- the polymerization inhibitor as the component (C) is contained in an amount of 0.01 to 0.50 parts by mass per 100 parts by mass of the component (A);
- and
- the adhesion aid as the component (D) is contained in an amount of 0.1 to 5.0 parts by mass, per 100 parts by mass of the component (A).
Dependencies are inferred from the claim text.