High temperature three dimensional printing compositions
AssigneeNovoset, LLC
InventorsSajal Das, Christopher N. Das, Patrick Shipman, Benjamin G. Baxter
Life of this patent
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Abstract
A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.
Claims6
A high performance and high temperature resin composition for three dimensional printing formed from a two stage cure, consisting of a first stage curable group (Component A), and a second stage curable group cured by thermal/heat cure (Component B);
- wherein Component A is selected from a photo-curable group, a peroxide curable group, a EB curable group, a cationic curable group, an IR curable group, an addition cure group, a condensation reactive group, and/or a chemical additive curable group;
- wherein Component B is selected from a cyanate ester, bismaleimide (BMI), benzoxazine, polyimide, phthalonitrile resin (PN), bismaleimide triazine (BT), silicone resin, epoxy, cyanate epoxy and mixtures thereof.
Dependencies are inferred from the claim text.