Resin composition, and prepreg and use thereof

Abstract

The present application relates to a resin composition, a prepreg, and use thereof. The resin composition includes following components: 50 to 150 parts by weight of a modified epoxy resin; 40 to 120 parts by weight of a modified benzoxazine resin; 20 to 100 parts by weight of a bismaleimide resin; 0.1 to 15 parts by weight of an initiator; and 150 to 550 parts by weight of an inorganic filler, wherein the modified epoxy resin is represented by structural formula (1-1): the modified benzoxazine resin is a base benzoxazine resin with a terminal group modified with a double bond structure. In the resin composition, the polybutadiene-modified epoxy resin and the bismaleimide resin can together form an interpenetrating polymer network, thereby achieving the resin composition with a low dielectric constant, a low dielectric loss, and a low linear thermal expansion coefficient.

Dependencies are inferred from the claim text.