Resin composition and product made therefrom
AssigneeElite Material Co., Ltd.
InventorsTse-Hung Liu, Chia-Hung Wu, Wu-Ching Wu
Life of this patent
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Abstract
A resin composition is provided, which comprises: 100 parts by weight of resin A including vinyl group-containing polyphenylene ether resin or maleimide resin; 5 parts by weight to 15 parts by weight of a compound having a structure represented by Formula (1); and 2 parts by weight to 15 parts by weight of a compound B including a compound having a structure represented by Formula (2), a compound having a structure represented by Formula (3) or a compound having a structure represented by Formula (4). Also, a product made from the aforesaid resin composition is provided, including a resin-coated copper, a laminate or a printed circuit board.
Claims7
A resin composition, comprising:
- 100 parts by weight of resin A, comprising vinyl group-containing polyphenylene ether resin or maleimide resin;
- 5 parts by weight to 15 parts by weight of a compound having a structure represented by Formula (1);
- and
- 2 parts by weight to 15 parts by weight of a compound B, comprising a compound having a structure represented by Formula (2), a compound having a structure represented by Formula (3) or a compound having a structure represented by Formula (4);
- wherein
- in Formula (1), m is an integer of 2 to 18;
- in Formula (3), each of a1, a2 and a3 is independently an integer of 0 to 7;
- in Formula (4), each of b1, b2, b3 and b4 is independently an integer of 0 to 9.
Dependencies are inferred from the claim text.