Resin composition and article made therefrom
AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsMingsheng Yuan, Rongtao Wang, Yiqiang Ge
Life of this patent
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Abstract
A resin composition and an article made therefrom are provided. The resin composition includes: (A) 100 parts by weight of a maleimide resin; (B) 30 to 120 parts by weight of a compound of Formula (1); and (C) 3 to 20 parts by weight of a compound of Formula (2). The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including thermal decomposition temperature, percent of thermal expansion in Z-axis, reflow shrinkage-stretch rate, flexural modulus and storage modulus decay rate.
Claims16
A resin composition, comprising:
- (A) 100 parts by weight of a maleimide resin;
- (B) 30 to 120 parts by weight of a compound of Formula (1);
- and
- (C) 3 to 20 parts by weight of a compound of Formula (2),
- in Formula (1), n is an integer of 3 to 6, and X and Y each independently represent o-vinylphenoxy group, m-vinylphenoxy group or p-vinylphenoxy group;
- in Formula (2), each X′, Y′ and Z′ independently represent an alkyl group with 1 to 4 carbon atoms, a phenyl group, a hydrogen atom or an unsaturated C═C double bond-containing group.
Dependencies are inferred from the claim text.