C08G 59/5053
Containing only nitrogen as a heteroatom
Official title: {containing only nitrogen as a heteroatom}
C08G59/5053 (Containing only nitrogen as a heteroatom) appears on 370 US grants and 368 published applications in this corpus.
Search patents in C08G- Granted patents
- 370
- Published applications
- 368
- Assignees
- 225
- Inventors
- 1,154
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 6 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 12 | 0 |
| 1986 | 6 | 0 |
| 1987 | 3 | 0 |
| 1988 | 6 | 0 |
| 1989 | 6 | 0 |
| 1990 | 8 | 0 |
| 1991 | 9 | 0 |
| 1992 | 14 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 4 | 0 |
| 1996 | 12 | 0 |
| 1997 | 7 | 0 |
| 1998 | 10 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 4 | 0 |
| 2002 | 4 | 2 |
| 2003 | 1 | 3 |
| 2004 | 3 | 0 |
| 2005 | 1 | 3 |
| 2006 | 0 | 1 |
| 2007 | 1 | 6 |
| 2008 | 0 | 1 |
| 2009 | 1 | 4 |
| 2010 | 1 | 15 |
| 2011 | 2 | 6 |
| 2012 | 3 | 13 |
| 2013 | 6 | 13 |
| 2014 | 9 | 14 |
| 2015 | 5 | 20 |
| 2016 | 8 | 19 |
| 2017 | 16 | 27 |
| 2018 | 23 | 29 |
| 2019 | 29 | 39 |
| 2020 | 18 | 24 |
| 2021 | 19 | 31 |
| 2022 | 21 | 26 |
| 2023 | 10 | 17 |
| 2024 | 15 | 25 |
| 2025 | 13 | 19 |
| 2026 | 3 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resin composition, resin cured product, and fiber reinforced resin14 Jul 2026US 12,679,925 B2Hitachi, Ltd.
- Bonding method16 Jun 2026US 12,655,333 B2Nitto Denko Corporation
- High modulus, toughened one-component epoxy structural adhesives with high aspect ratio fillers12 May 2026US 12,624,262 B2Ddp Specialty Electronic Materials US, LLC
- Composite molded article23 Dec 2025US 12,503,597 B2Jsp Corporation
- Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material4 Nov 2025US 12,460,043 B2The Yokohama Rubber Co., Ltd.
- Heat-curing epoxy resin composition suitable for low curing temperature with good storage stability24 Sep 2026US 2026/0286039 A1Sika Technology AG
- Resin composition, film, film set, optical waveguide, opto-electric composite substrate, and electronic component30 Jul 2026US 2026/0218020 A1Sumitomo Bakelite Co., Ltd.
- Insulating resin composition, cured product and electronic component16 Jul 2026US 2026/0201143 A1Namics Corporation
- Chemical-resistant protective film9 Jul 2026US 2026/0193459 A1Nissan Chemical Corporation
- Thermoplastic adhesives compositions and method for producing such thermoplastic adhesive compositions11 Jun 2026US 2026/0159733 A1The Swatch Group Research and Development Ltd
Most cited
By later US patents
- Tube sheets for permeators64US 4,323,453 AMonsanto Company · 1982
- Unitary curable resin compositions49US 4,066,625 AAmicon Corporation · 1978
- Macrocyclic polyamines43US 4,001,212 AE. I. Du Pont de Nemours and Company · 1977
- Co-curing agents for epoxy resins42US 4,268,656 ANational Starch and Chemical Corporation · 1981
- Epoxy-containing die-attach compositions39US 5,969,036 AThe Dexter Corporation · 1999